Electronics Forum: thermal cycles (Page 1 of 33)

Multiple reflow cycles

Electronics Forum | Wed Mar 19 21:01:49 EST 2003 | Rob

I would suggest creating a special reflow profile, heating the board up to 130C about 50 c below eutectic point (183C). Then applying heat to only the BGA, this will prevent thermal shock to surrounding components.

Thermal cycles of tin lead solder in the Wave

Electronics Forum | Tue Oct 04 12:49:59 EDT 2005 | patrickbruneel

The amount of times the tin/lead solder can be melted and solidified is unlimited and the heat cycles do not affect the solder characteristics. The only reason for changing the solder pot is when impurities are at or over the maximum levels.

Thermal cycles of tin lead solder in the Wave

Electronics Forum | Tue Oct 04 11:42:07 EDT 2005 | Bob Leible

I was wondering if anyone has studied the effects of tin lead solder in the wave. If we leave the same solder in the solder pot, how many COMPLETE cool downs and start ups can the solder go through before it begins to break down? Please let me know

Number of thermal excursions per componet

Electronics Forum | Wed Jun 27 21:05:48 EDT 2001 | davef

BGA Cycle 1: solder ball attach. BGA Cycle 2: BGA attach to board. BGA Cycle 3: BGA removal from board. BGA Cycle 4: BGA pad dress. BGA Cycle 5: BGA ball replacement. BGA Cycle 6: BGA re-attach to board. Board Cycle 1: BGA attach to board. Boar

Re: Rework induced thermal shock of SMD capacitors

Electronics Forum | Wed Dec 31 08:55:09 EST 1997 | justin medernach

| Has anyone had any experience with thermal shocking | and cracking of SMD capacitors during the rework process? | My company was advised to preheat capacitors to 125 C | at a rate of 2 C/sec before replacing them onto boards. | Would this maybe

solder joint crack in post thermal cycling test at Dye & Pry

Electronics Forum | Sun Apr 11 11:39:52 EDT 2010 | manchella

When we have sent some of motherboards for reliability testing in a tird party laoratory. It is found that when Dye&Pry is done after 600 cycles of Thermal Cycling, in LGA socket only one of the corner solder joing had 100% type 3 crack. All other so

solder joint crack in post thermal cycling test at Dye & Pry

Electronics Forum | Tue Apr 13 08:21:05 EDT 2010 | esca

Hi manchella, After ATC test, two different failure modes can be present: solder FATIGUE (into bulk) or BRITTLE INTERMETALLIC fracture. So, first you have to verify this. Moreover, which brand of SMT paste have you used ? The crack into solder joint

Solder Paste for Thermal Cycling application (-40 to 150 Degree Celcius)

Electronics Forum | Sun Dec 10 20:17:51 EST 2017 | myke03o

Hi Dave, thanks for the response. * Improve your products that are used for thermal cycling testing of products of other companies? Yes we want to improve our products to pass thermal cycling and prolong the lifespan of the baord. * Change your pr

Solder Paste for Thermal Cycling application (-40 to 150 Degree Celcius)

Electronics Forum | Thu Nov 23 20:01:05 EST 2017 | myke03o

Hi to all experts, Can anyone advice us what solder alloy to use for thermal cycling products. We are facing a lot of issues using normal solder paste SAC305. After thermal cycling the solder is cracking. Any suggestion is welcome. Thanks in advanc

How to get away jointing problem

Electronics Forum | Mon Apr 04 08:01:49 EDT 2005 | davef

Can you run one thermal cycle to attach the BGA and then a different thermal cycle to attach the connector?

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