Industry News: thermal monitoring (Page 1 of 32)

Heller Industries Announces Joint Development Agreement with IBM for Fluxless Mass Reflow Soldering Process for High Volume Manufacturing

Industry News | 2013-08-15 20:58:22.0

Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.

Heller Industries Inc.

Advances in Heated Dispense Process

Industry News | 2016-06-27 14:59:09.0

GPD Global introduces the NEW TempView Thermal Imaging System that ensures the success of heated dispensing processes like Underfill, Encapsulations, Dam and Fill, and more. The TempView Thermal Imaging System monitors the temperature of the entire substrate for complete heat profile characterization. Regions of the product may be selected for monitoring during the heating process. Now you can accurately monitor temperature of specific devices to be sure they are up to temperature before starting a process.

GPD Global

2002 NEMI Roadmap Points to Areas of Opportunity for Industry

Industry News | 2003-04-07 10:16:38.0

Portable Products and Optoelectronic Applications Still Hold Promise for Growth

SMTnet

ITW EAE Wins Vision Awards for MPM Paste Management System and Electrovert Adjustable Wave

Industry News | 2020-08-28 03:07:38.0

ITW EAE is proud to announce that it has earned two Vision Awards for innovative MPM and Electrovert technology developments. MPM received a Vision Award for a new paste monitoring system featuring temperature monitoring as well as upper and lower limit roll-height monitoring. Electrovert received a Vision Award for the new DwellFlex 4.0 variable contact wave solder nozzle. The awards were presented at NEPCON Asia.

ITW EAE

XDry Introduces the XDry M.O.L.E.

Industry News | 2009-10-16 16:10:36.0

User-Configurable Process Audit Tool

XDry

MPM Introduces Next Generation Momentum II Printer

Industry News | 2019-11-05 12:11:26.0

ITW EAE is introducing the MPM® Momentum II™ Printer as the next generation of the highly successful Momentum printer line. The Momentum II features a new set of enhanced technologies that bring further advancement in quality, yield, productivity, ease of use and flexibility.

ITW EAE

MPM Completes Next Generation Momentum II Printer Line with Introduction of BTB and 100 Models

Industry News | 2020-04-14 19:07:23.0

ITW EAE introduced the next-generation MPM® Momentum® II Printer with the release of the HiE and Elite models in November of 2019. Now the company is releasing the Momentum II BTB and Momentum II 100. The Momentum II BTB is a Back-to -Back configurable stencil printer that allows dual-lane processing for higher throughput without increasing either line length or capital investment.

ITW EAE

Nordson ASYMTEK's Helios™ SD-960 Series Automated Dispensing System dispenses medium and bulk volume deposits of single- (1K) and two-component (2K) fluids and supports highly abrasive

Industry News | 2018-03-22 21:11:24.0

Nordson ASYMTEK introduces the new Helios™ SD-960 Series Automated Dispensing System for medium and bulk volume deposits of single- (1K) and two-component (2K) materials in electronics manufacturing and printed circuit board assembly. The Helios system is ideal to deposit volumes greater than 1cc, and line widths and dots that exceed 1mm, but it can deposit volumes down to 0.3cc and line widths as narrow as 0.3mm. The system supports highly abrasive thermal interface materials (TIM), silicones, epoxies, and grease for applications such as potting, sealing, gasketing, and structural adhesives.

ASYMTEK Products | Nordson Electronics Solutions

Electronics in Harsh Environments Conference Announced

Industry News | 2017-08-26 20:18:39.0

SMTA and SMART Group are excited to announce plans to co-organize the Electronics in Harsh Environments Conference. The event will be held April 24-26, 2018 in Amsterdam, Netherlands. The conference will focus on building reliable electronics used in power electronics and harsh environments.

Surface Mount Technology Association (SMTA)

Best Papers from SMTA International Announced

Industry News | 2021-02-05 09:31:21.0

The SMTA is pleased to announce the Best Papers from SMTA International 2020. The winners were selected by members of the conference technical committee. For these exceptional achievements, a cash award and plaque are given to primary authors of all winning papers.

Surface Mount Technology Association (SMTA)

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