Electronics Forum | Tue Feb 18 19:07:21 EST 2003 | arturoflores
Our case is not due to thermal pad print squeezing because our shorts are mostly in the outer rows of the BGA so they cannot be caused by central pad printing. We still stick to the BGA thermal pad coplanarity/height hypothesis but have not yet prove
Electronics Forum | Fri Dec 27 10:04:56 EST 2002 | haran
Big pad located at the middle of the package. On the PCB,we need to have solder paste printed on the thermal pad which is at the middle and the other pads of the perimeter BGA.
Electronics Forum | Sat Dec 28 02:58:12 EST 2002 | emeto
If the problem is in the big thermal pad.The surface strains in that pad are different then the others and through the reflow period there is an affinity between them(only if they are too close). I recommend you to reduce the theramal pad. Make smal
Electronics Forum | Wed Jun 27 21:05:48 EDT 2001 | davef
BGA Cycle 1: solder ball attach. BGA Cycle 2: BGA attach to board. BGA Cycle 3: BGA removal from board. BGA Cycle 4: BGA pad dress. BGA Cycle 5: BGA ball replacement. BGA Cycle 6: BGA re-attach to board. Board Cycle 1: BGA attach to board. Boar
Electronics Forum | Wed Oct 05 13:30:01 EDT 2011 | leemeyer
We are required by most of our customers to apply a serial # to the boards that we build. As the PC boards have been getting smaller and open areas on the board are getting scarce we have been forced into using smaller and smaller labels. I am lookin
Electronics Forum | Mon May 12 04:26:00 EDT 2014 | gazelle
Hello - I am looking for a source to supply low thermal EMF solder - can anyone provide pointers ? In the past a cadmium - lead alloy was used for this, but these are banned (RoHs) ... - the aim is to minimize thermo-couples on a very sensitive 4 lay
Electronics Forum | Thu May 06 19:21:24 EDT 2021 | markhoch
Verify your aperture reductions in the stencil. Are the solderballs always in the same location? Same size & shape? Is the solder leaching through plated thermal holes from the opposite side of the PCB? Are you using stencil apertures designed to min
Electronics Forum | Wed May 07 15:42:11 EDT 2008 | joeherz
We have a need to print (via thermal transfer) labels with heights of
Electronics Forum | Mon Dec 18 17:56:26 EST 2000 | Dave F
Does the thermal conductivity of a copper trace on a printed circuit board change as the copper oxidizes? Is the oxide on copper a thermal insulator? If so, should it be considered in an analysis of thermal resitivity between a ground plane and a h
Electronics Forum | Tue Jun 13 13:34:10 EDT 2006 | jsmith01
Does anyone have a Manual for a Hughes/Palomar Htt-1000 power supply and a VTA-96 weld head? I acquired these machines to do a small job that we need to attach a flex cable to a thermal print head. As far as I can tell this division of Hughes was s
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