Industry Directory | Manufacturer
Manufactures and Provides: thermal interface materials (TIM) including insulated-metal-substrates, gap-filling compressible phase-change pads, thermal gels-greases,(EMI/RFI) mitigation conductive gaskets and other products.
The Helios™ SD-960 Series is developed for medium to large volume dispensing applications in Electronics Assembly, like Thermal Interface Material (TIM), Potting, Gasketing and Sealing. The new Helios™ SD-960 Series (SD-960) handles a broad range of
SMTBOX supports various kinds of original SMT spare parts for Hitachi Sanyo Electronic Applied Systems GXH-1S,GXH-1JS,GXH-1J,GXH-3,GXH-3J, TCM-3000, TCM-1000, TCM-X100, TCM-X200, TIM-3000, TIM-5000 and many more such like such like feeder,nozzle and
Electronics Forum | Wed Jul 24 06:59:43 EDT 2002 | lloyd
Teson themselves in England have closed as you have now found out. After alot of searching we found that one of their employees went to Capital Equipment. We've had no contact with them recently but you could try Tim Lloyd on tim@capitalequip.co.uk
Electronics Forum | Sun Nov 05 11:52:41 EST 2006 | csm
Can somebody let me know if Sanyo TIM-1000 pick and place can mount BGA's? and qty dots per hour of TDM-1000. I will apreciate your importants comments Regards.
Used SMT Equipment | SMT Equipment
HI , We have one set each of Sanyo TIM 1000 and TIM 1100 IC mounter. comes with feeders etc and Tray unit. If any interest , please contact us. thanks adrian
Used SMT Equipment | SMT Equipment
HI , we would like to sell our Sanyo TIM 1100L and TIM 1000L . Please contact us. Thanks adrian
Industry News | 2003-03-18 10:12:41.0
The Falcom JP7 is a single-board GPS receiver with 12 parallel channels.
Industry News | 2003-06-09 09:41:14.0
Mehlo Bauelemente GmbH specialises in electronic packaging and has 20 years experience serving the German market with a wide range of enclosure products.
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Parts & Supplies | SMT Equipment
DEK DEK belt (119175) TIMING if need more info about SMT spare parts, pls don’t hesitate to contact with us at any time.More info pls visit our website:www.ksunsmt.com. Email: alice@ksunsmt.com Skype: alice@ksunsmt.com Whats app: +86
Parts & Supplies | Pick and Place/Feeders
SANYO 8x2mm Tape Feeder Feature : 8x2mm Tape Feeder, For Hitachi/Sanyo TCM-1000, TCM-1050, TCM-1100, TCM-1500, TCM-1600，TCM-3000, TCM-3100, TCM-3200, TCM-3500, TCM-3700, TIM5000, Universal HSP-4796 Chip Mounting System Brand : SANYO Unit :
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
we have many hitachi equipment and hitachi feeders to sell . if you want to know more , please contact us tina@smtfeeders.cn
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Career Center | Round Rock, Texas USA | Management,Production,Purchasing
With Supply Chain and manufacturing management experience that includes startups, turnarounds and major growth initiatives for high-tech electronics firms, I have significant accomplishments in building and efficiently running companies. If your firm
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/fluid-types/thermal-interface-material-tim
Thermal Interface Material (TIM) | Nordson ASYMTEK ASYMTEK Products Corporate | Global Directory | Languages Division Only All of Nordson Fluid Dispensing Systems Jets
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_via-guidance-request-from-tim-c_topic538.xml
PCB Libraries Forum : VIA Guidance Request From Tim C. PCB Libraries Forum : VIA Guidance Request From Tim C. This is an XML content feed of
