New Equipment | Education/Training
Solder Training and Solder Certification Courses Taught in Accordance With IPC Soldering Guidelines. We offer a variety of customized courses set up specifically for our customers requirements. An example would be our combination type certificate t
Terminals Harwin Terminals are useful for a variety of connection styles and location requirements. Choice of turned and blade designs. Solder and wire-wrap location points. Test points. Single male contact for use with applicable
Electronics Forum | Thu Mar 25 09:38:36 EDT 2021 | spoiltforchoice
Well everything Graham said with some additional points.. You mention manual printing but very little about your stencil or setup. Everything you have said indicates a very limited budget has been expended, however what you have is an extreme exampl
Electronics Forum | Tue Mar 03 02:39:56 EST 2015 | sarason
I would presume you reflow the top of the board first. Use tented vias. As you have worked out, vias have surface tension, which sucks the solder up the hole during reflow of the bottom of the board. Good luck! regards sarason
Used SMT Equipment | Pick and Place/Feeders
FEATURES ▶Higher productivity and quality with printing, placement and inspection process integration▶For larger boards and larger PCBs up to a size of 750 x 550 mm with component range up to L150 x W25 x T30 mm▶Higher area productivity through dual
Used SMT Equipment | Semiconductor & Solar
1000KG Overhead Bridge Crane. Speed 4.9/1.2 MMIN and 500Kg glass frame hoist
Industry News | 2003-03-11 08:45:00.0
CAMtastic DXP is the latest version of Altium's complete CAM verification and editing system that bridges the gap between PCB design and manufacturing and facilitates communication between board designers, fabrication engineers, and their clients.
Industry News | 2018-10-18 07:56:58.0
Wave soldering process defectives and handling solution
Parts & Supplies | Assembly Accessories
Brand Machine Model Specification FUJI CP3 / CP4 Bore diameter 0.7 / 1.0 / 1.3 FUJI CP6 / CP7 Bore diameter 0.7 / 1.0 / 1.3 / 1.8 FUJI CP6 / CP7 Bore diameter 2.5 / 3.7 / 5.0 FUJI XP141 / 142 Bore diameter 2.5 / 3.7 / 5.0 FUJI XP141 / 142 0.7 /
Parts & Supplies | Assembly Accessories
Pick and Place Machine JUKI FEEDER UPPER COVER 5632 E82037060AB Specifications: Brand Name JUKI FEEDER UPPER COVER Part number E82037060AB Model FF56FS Ensure Test in machine before shipping Guarantee Original 100% Supply all juki spare
Technical Library | 2006-11-14 12:48:31.0
Content: 1. Bridge from Commercial Reliability 2. Existing PBGA use in Aerospace & Military 3. Drivers: Plastic versus Ceramic Package Weight 4. Attributes of PTFE and Thin Core FC Packages 5. Flip Chip Package Reliability 6. Flip Chip Package
Technical Library | 2012-04-12 21:25:13.0
Surface mount technology (SMT) started in the 1960s and became more common in the 1980s. It is the dominant technology in use today. Through-hole technology is still in use, and will be for the foreseeable future, but the drive towards miniaturization of
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Events Calendar | Tue May 15 00:00:00 EDT 2018 - Tue May 15 00:00:00 EDT 2018 | ,
Parts and Assembly Storage Life: How to Determine and Manage
Career Center | Manhattan, Kansas USA | Production
Ultra Electronics, ICE is a leader in small aircraft aerospace systems and components. ICE secured its first contract in the aircraft industry in 1975 by designing and manufacturing a state-of-the-art deicer timer for Cessna Aircraft Company. ICE c
Bridging at Reflow, What is the Cause and Can it be Eliminated? SMTnet Express April 12, 2012, Subscribers: 25060, Members: Companies: 8851, Users: 32937 Bridging at Reflow, What is the Cause and Can it be Eliminated? by: Robert Dervaes, V
Heller Industries Inc. | https://hellerindustries.com/bridging-defects/
. Process and design-related causes of PCB Bridging Defects: Excessive volume of solder due to improper pad dimension Excessive volume of solder due to improper stencil aperture Improper application of solder mask Excessive slump of solder paste Reflow-related causes
KingFei SMT Tech | http://www.smtspare-parts.com/sale-8463755-original-tiny-smt-nozzle-evest-machine-anv1-2n2a010a-nozzle-assy.html
Original Tiny SMT Nozzle Evest Machine ANV1 2N2A010A Nozzle Assy Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
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