New Equipment | Design Services
Our design services – the total package. At i3, we are the premier supplier of leading-edge PCB and semiconductor package designs. We maintain a highly skilled team of design engineers with more than 170 years of collective experience in the desi
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Supplier: Shenzhen Grande Electronics Layers: 4 Application: Grande - Automobile PCB Prototyping and Manufacturing PCB Parameter: FR-4/HTG150 Thickness: 1.6mm Surface Treatment: ENIG Testing: 100% E-test Package: Vacuum packing Lead Time: 10-15 da
Electronics Forum | Fri Aug 26 09:57:21 EDT 2005 | russ
The Immersion gold is not a problem with BGAs specifically but "black pad" which can be present anywhere. The unfortunate thing with BGAs is you cannot see it. Personally I hate white tin. It is okay for single sided boards running no-clean, but c
Electronics Forum | Sat Oct 06 08:42:21 EDT 2001 | davef
Please give us additional background on your board, solder, process, etc. If you are talking about black pad in ENIG solderability preservative, check the fine SMTnet archives to get started.
Industry News | 2011-02-24 20:35:03.0
The SMTA is pleased to announce the program for the 2011 International Conference on Soldering and Reliability being held May 3-6 in Toronto, Ontario, Canada.
Industry News | 2010-09-13 15:36:15.0
IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.
Technical Library | 2019-06-07 14:49:54.0
ACI Technologies was contacted in regards to poor solder joint reliability. The customer submitted an assembly that was exhibiting intermittent opens at multiple locations on a ball grid array (BGA) component. The assembly’s functionality did not survive international shipping, essentially shock and vibration failures, immediately making the quality of the solder joints suspect. The customer was asked about the contract manufacturer and the reflow oven profile as well as the solder paste and surface finish used. The ACI engineering staff evaluated the contract manufacturer’s technique and determined that they were competent in the methods they used for placing thermocouples in the proper locations and developing the reflow oven profile. The surface finish was unusual, but not unheard of, in that it was hard gold over hard nickel, rather than electroless nickel immersion gold (ENIG). The customer was able to supply boundary scan testing data which showed a diagonal row of troublesome BGA pins.
Technical Library | 2013-01-17 15:34:33.0
The use of an electroless nickel, immersion gold (ENIG) surface finish comes with the inherent potential risk of Black Pad failures that can cause fracture embrittlement at the interface between the solder and the metal pad. As yet, there is no conclusive agreed solution to effectively eliminate Black Pad failures. The case studies presented are intended to add to the understanding of the Black Pad failure mechanism and to identify both the plating and the subsequent assembly processes and conditions that can help to prevent the likelihood of Black Pad occurring.
Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm
. Three surface finishes including OSP, ImAg, and ENIG are considered. The test vehicle consists of 15mm and 6mm Ball Grid Array (BGA) components. The assembled test boards were isothermally aged at 125oC for 12 months, which are then thermally cycled between -40oC to
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
] Investigation Specifics: 84 I/O Plastic CSP, daisy chained, 0.3mm (12 mil) diameter solderballs Sn63 solder paste Test vehicle: Characteristics not available, Immersion Silver (IAg) and ENIG finishes Thermal cycling: 0°C-100
