Electronics Forum | Mon Feb 10 03:28:04 EST 2014 | cspasol
Thank you for the information. I have 1 more thing to ask, Venting: Three 4” (102mm) dia. flanges 200 CFM (340m3/h) ea. What thus three 4" specify? Is it the number of exhaust ventilation? and 200 CFM could be the specs per exhaust?
Electronics Forum | Fri May 13 14:08:39 EDT 2011 | eezday
This appears to be black-pad and is often the result of using specs that call for gold plating that is too thick. The black pad is corrosion that is created between the gold and electroless nickel during the gold plating process. This is counter in
Electronics Forum | Wed Sep 05 14:51:47 EDT 2001 | gdstanton
Well, it appears after running both a bare and populated PWB we were seeing flux exhaustion on the uBGA. The problem apparently resulted by a recent maintenance effort where the air blowers in the reflow oven were replaced. The blower replacement m
Electronics Forum | Mon Jun 25 19:36:36 EDT 2007 | bga_kid
If you calculate CFM using the numbers you have provided you are pulling 1396CFM out of the oven. I am not sure what Hellers spec is but I know a Speedline OmniExcel Air machine should be set at 300CFM. I do know for a fact that to much exhaust can s
Electronics Forum | Thu Aug 10 10:00:40 EDT 2006 | slthomas
Temp. and humidity levels are dependant upon your chemical (paste and adhesive) specifications. Ballpark I'd say 70�F and 40%-45% RH are good targets, as our paste spec. says optimal ranges are 70-77� and 30-70 RH. As far as air quality, if you bui
Electronics Forum | Mon May 06 11:49:20 EDT 2002 | Jacob
Hello all, I am having soldering issues with an Everlight component it is a TM4201/TR2 (Right angle IRDA with a 1mm pitch). The problem I have is that after reflow the solder joints look perfect, but during test we are losing 7 micro amps as soon as
| 1 |
winsouce.jpg)