Industry Directory: two passes (7)

KimLar Industries

Industry Directory |

KimLar Industriess is a

Radiationcomputerstation.com

Radiationcomputerstation.com

Industry Directory | Marketing Agency

RadiationComputerStation.com Does Two main things: Computer repair/refurb and affordable Internet Marketing.

New SMT Equipment: two passes (285)

Vertical Curing Oven - Heller 788

Vertical Curing Oven - Heller 788

New Equipment | Curing Equipment

Heller 788 In-line, Continuous Cure, Vertical Format Oven This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.

Heller Industries Inc.

K2000XY

K2000XY

New Equipment | Depaneling

The K2000 XY helps reduce damage from depaneling resulting from operator fatigue. One of the major causes of board damage during PCB singulation is due misalignment or tilting of the PCB during the process. The support table on the K2000XY provides

FKN Systek

Electronics Forum: two passes (217)

manual stencil print 2 passes

Electronics Forum | Tue Dec 23 17:34:07 EST 2008 | davef

We hear you talking two main issues: 1 Solder paste release 2 Thoughts on using two passes of solder paste on the stencil 1 Solder paste release * Check your aperture & aspect ratios [Search the fine SMTnet Archives for more] * Do a better job with

manual stencil print 2 passes

Electronics Forum | Mon Dec 22 12:14:15 EST 2008 | pcbbuilders

we sometimes have problems with solder paste release. we use a manual stencil printer. does anyone have any thoughts on using two passes of solder paste on the stencil? i have found that running the second pass gives me better deposits on the fine pi

Used SMT Equipment: two passes (41)

Stanford Research SR650

Stanford Research SR650

Used SMT Equipment | In-Circuit Testers

Stanford Research SR650 Programmable Filter. One of the SR600 series of products. The SR600 series consists of three dual-channel instruments. Each instrument channel has a low-noise preamplifier, a precision high-pass or low-pass filter sectio

Test Equipment Connection

SEHO Power Selective

SEHO Power Selective

Used SMT Equipment | Soldering Equipment/Fluxes

Seho Power Selective - Selective soldering machine 2011 vintage - NEVER USED IN PRODUCTION selective spray fluxer LEAD FREE system  Two lead free pots  inline system - pass thru coneyor AUCTION ITEM - SRI NORTH America  Absulote auction

Cardinal Circuit Auctions

Industry News: two passes (169)

GPD Global's PCD Dispensing on Its MAX Series Platform Recognized with Two 2011 Global Technology Awards

Industry News | 2011-11-20 13:36:13.0

GPD Global has been awarded two Global Technology Awards in the categories of Adhesives/Coatings/Encapsulants and Dispensing Equipment for its PCD Dispensing on the MAX Series Platform

GPD Global

Airbus Défense & Space Chooses iineo Placement Platform.

Industry News | 2017-07-12 17:03:17.0

Elancourt-based Airbus Défense & Space, the world's second-largest space company, has selected Europlacer's iineo placement platform for its high-mix, low-volume production requirements.

EUROPLACER

Parts & Supplies: two passes (18)

Juki JUKI SMT Feeder Cart / SMT Chip Mounter Feeder Trolley Storage Cart For SIEMENS X Machine

Juki JUKI SMT Feeder Cart / SMT Chip Mounter Feeder Trolley Storage Cart For SIEMENS X Machine

Parts & Supplies | Chipshooters / Chip Mounters

Smt Chip Mounter feeder storage cart for SIEMENS X series machine Product Name: SIEMENS Smt feeder storage cart Dimensions(mm):800*600*11000 Product Description:40 / Layer, 2 Layers Uses: For placing feeder, feeder preparation in advance, Fee

KingFei SMT Tech

Juki Lightweight / Durable FUJI NXT Feeder Trolley , Juki Feeder Trolley Storage Cart

Juki Lightweight / Durable FUJI NXT Feeder Trolley , Juki Feeder Trolley Storage Cart

Parts & Supplies | Pick and Place/Feeders

FUJI NXT feeder trolley storage smt pcb assembly equipment feeders Product Name:FUJI CP6 smt feeder storage cart Dimensions(mm):800*600*1150 Product Description:35 / Layer, 2 Layers Uses: For placing feeder,feeder preparation in advance,Feeder

KingFei SMT Tech

Technical Library: two passes (320)

Throughput vs. Wet-Out Area Study for Package on Package (PoP) Underfill Dispensing

Technical Library | 2012-12-17 22:05:22.0

Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.

Nordson ASYMTEK

Higher Defluxing Temperature and Low Standoff Component Cleaning - A Connection?

Technical Library | 2020-11-04 17:49:45.0

OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.

ZESTRON Americas

Videos: two passes (48)

This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.

This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.

Videos

Heller 788 In-line, Continuous Cure, Vertical Format Oven This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.

Heller Industries Inc.

PCB traverser

PCB traverser

Videos

The PCB Traverser has horizontal movement and go-through functions, is used for transporting boards from one line into two lines. The more detail and video please check the link: www.ascen.ltd       Any inquiry please se

ASCEN Technology

Training Courses: two passes (17)

IPC-7711/7721 Specialist (CIS) Certification Training Course

Training Courses | | | IPC-7711/7721 Specialist (CIS)

The Certified IPC-7711/7721 Specialist (CIS) training focuses on rework of electronic assemblies and repair and modification of printed boards and electronic assemblies.

Circuit Technology Inc.

IPC-A-610 Trainer (CIT) Certification Training Course

Training Courses | | | IPC-A-610 Trainer (CIT)

The Certified IPC-A-610 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of electrical and electronic assemblies and prepares them to deliver Certified IPC-A-610 (CIS) training.

Technical Training Center

Events Calendar: two passes (43)

IPC 7711 Operator Certification

Events Calendar | Mon Jun 22 08:00:00 EDT 2015 - Fri Jun 26 16:00:00 EDT 2015 | Rosemount, North Carolina USA

IPC 7711 Operator Certification

BEST Inc.

IPC 7711 Operator Certification

Events Calendar | Mon Jun 15 08:00:00 EDT 2015 - Fri Jun 19 16:00:00 EDT 2015 | Raleigh, North Carolina USA

IPC 7711 Operator Certification

BEST Inc.

Career Center - Resumes: two passes (8)

JOB ON CONTRACT BASIS

Career Center | Trivandrum, kerala India | Engineering

Assembly Level Programming (8 Bit & 16 Bit), C, C++. Operating systems known: Embedded Linux, RTOS, Vx-Works. •Microcontrollers known :ATMEL-89C52, ARM- ARM920T, DSP- TMS320C5510. Tools known Kiel, MPLAB, Code Warrior, Code Compressor Studio. •Pr

Vinoth Kumar

Career Center | Chennai, Tamilnadu India | Engineering,Maintenance,Purchasing,Quality Control,Sales/Marketing,Technical Support

I have two year experience in debugging and SMT,THT, and BGA reworking at Avalon technology..

Express Newsletter: two passes (305)

SMT Express, Issue No. 4 - from SMTnet.com

SMT Express, Issue No. 4 - from SMTnet.com Volume 1, Issue No. 4 Tuesday, September 14, 1999 Featured Article Return to Front Page CFM Increases First-pass Yield by Bob Bilbrough, Quality Contract Manufacturing, LLC If CFM is so valuable

Partner Websites: two passes (144)

Library Expert 2015.01 Released!! - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/library-expert-2015-01-released_topic1458_post5876.html

: Added Molded Body Diode, Non-polarized Allegro/OrCAD PCB: The pins will be generated in two passes in the script now. First electrical will be placed, then mechanical will be placed

PCB Libraries, Inc.

SMT Reflow Oven - PCBA Process-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/cc?ID=te_news_bulletin,10161&url=_print

. Next is the box assembly, which assembles the assembled PCB with the outer casing to form the finished product. That is to say, the PCB blank board passes through the SMT upper part, and then passes through the entire process of the DIP plug-in, referred to as PCBA


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