WINTECH is an accredited supplier of used Surface-Mount Technology (SMT)/Auto Insertion (AI)/SEMICON equipment. We also provide service, modification, solutions and spare parts for various types of equipment.
Time Pressure Liquid Dispensing Pump with Foot switch / Dry contact A great addition to Fully Automatic Dispensing System Time pressure is a versatile method of dispensing that functions across a wide range of viscosities. This dispensing method wo
Full-featured and compact benchtop dispense system robot offering accurate and repeatable dispense results! A benchtop dispense system does not mean "no features". The Catalina benchtop dispense system is a full-featured platform with these standard
Electronics Forum | Mon Jun 19 13:40:05 EDT 2000 | Dave White
Hi !! Test and Measurement World has pretty good website with graphics to help you interpret BGA fault types...just type in BGA and X-Ray once you arrive at the site. Best Regards, Dave White PDR/XYtronic Rework and X-Ray systems
Electronics Forum | Tue Oct 29 09:01:34 EST 2002 | russ
Does anybody know of any document(s) that define the different package types such as SOP, SOIC, VSOP, TSOP,TSSOP, QSOP, LQFP, VQFP, etc...? I am re-doing our component library and would like to use industry names for each component type. Thanks Rus
Industry News | 2013-10-08 18:35:41.0
GPD Global will debut its patent-pending FPC (Fluid Pressure Control) Dispensing System at SMTA International. FPC offers a breakthrough in uniform fluid dispensing by ensuring a consistent supply of fluid to the pump regardless of reservoir size or fluid level.
Industry News | 2017-05-03 23:42:40.0
GPD Global offers a breakthrough in uniform fluid dispensing and repeatability by ensuring a consistent fluid supply to the pump regardless of reservoir size or fluid level.
KD775&780 E3401-802-000 JUKIKD775 DISP NZ S2D/1S 0.6/0.3P=0.7 E3406-802-00 JUKI KD775 DISP NZ M1D/2S 0.7/0.4P=1.0 E3411-802-000 JUKI KD775 DISP NZ L1D/1S 0.9/0.6P=1.5 E3416-802-000 JUKI KD775 DISP NZ LL 2D/2S 0.9/0.6P=1.5 E3421-802-000 JUKI DI77
Technical Library | 2020-11-04 17:49:45.0
OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.
Technical Library | 1999-08-27 09:29:49.0
Contract packaging houses have to contend with a large mix of die types and products. Flexibility and quick turnaround of package types is a must in this industry. Traditional methods of die encapsulation, (i.e., use of transfer-molding techniques), are only cost effective when producing a large number of components. Liquid encapsulants now provide similar levels of reliability1, and are cost effective...
ii-Feed is based on the strengths of Europlacer's proven concept of a cart plus elements but incorporates key aspects of our individual feeder technology, merging the best of both technologies. http://www.europlacer.com/en/ii-feed.html
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Thu Jul 26 00:00:00 EDT 2018 - Thu Jul 26 00:00:00 EDT 2018 | ,
Cleaning for Reliability - Overcoming Challenges for Class III Assemblies - Online Webinar
Career Center | Damascus, Syria | Engineering,Maintenance,Production,Technical Support
Experience : 1- PCB Test Engineer For Telecom Products And TV - LCD Manufacturing as follow : - In-Circuit and Automatic Test Equipment Test - in-circtuit Emulator - Function Test - Automatic Optical Inspection Test - Toubleshooting Axial
DESICCANT TYPES 検索 共有する 地域 お問合せ先 終了 終了 検索 If you are searching for Safety Data Sheets, please visit our Document Finder すべての結果 終了 Facebook Twitter Linkedin E
Types of PCB and Their Advantages | Imagineering, Inc. Skip to main content Resources Support Contact Us FAQs Live Chat My Account 847-806-0003 Menu Capabilities Fabrication Technology Roadmap Materials Available HDI Tolerances Certifications Assembly