Industry Directory | Manufacturer
Axxon is the leading supplier in the field of dispensing and conformal coating systems. Target dispensing applications are flip-chip, under-fill, conformal coating, sealing, encapsulation, etc.
Easy plasma evaluation for as little as €3.00 by “color.” The indicator brings simplicity to plasma evaluation. Industry first technology can realize evaluation of in-plane distribution and 3d object. Very suitable for daily plasma
Electronics Forum | Wed Oct 23 09:41:49 EDT 2002 | Antonio
Can anyone give me a ran down process on CSP? Is it like BGA process that needs reflow? what oven do I need...vapor, nitrogen or convection? is under fill a necessity? when and why do i have to under fill? when not to underfill and why? etc.... than
Electronics Forum | Tue Jun 20 10:51:47 EDT 2006 | Chunks
Under fill them.
Used SMT Equipment | Adhesive Dispensers
Camalot FXD 8000 Dispenser Equipment Description Camalot FXD Model Number: 8000-1 Year 2009 - 2010 Weight Scale Needle Cleaner Laser Height Sensor 635SD Pump (Can be changed to different Pump) (3) Heater Plates (Under fill capable) Dispen
Used SMT Equipment | Adhesive Dispensers
This machine was never installed with less than one hour of run time, process under fill, it is available now, video of power on available packing skidding and loading available
Industry News | 2015-06-11 16:02:18.0
MIRTEC, "The Global Leader in Inspection Technology," will exhibit its most recent solutions for System in Package (SiP) inspection and measurement at SEMICON WEST 2015; July 14-16, 2015, at the Moscone Center in San Francisco, CA. Visitors are invited to booth # 2343 for a detailed demonstration of this exciting new technology.
Industry News | 2009-04-23 20:54:01.0
MINNEAPOLIS, MN � The SMTA is pleased to announce its latest technical event in Penang, Malaysia. The SMTA South East Asia Technical Conference on Electronics Assembly Technologies will be held November 19-20, 2009 at the Equatorial Hotel in Penang, Malaysia. Presentations are currently being solicited for the following key technology tracks:
Technical Library | 2016-04-28 14:43:23.0
Underfilling is a long-standing process issued from the micro-electronics that can enhance the robustness and the reliability of first or second-level interconnects for a variety of electronic applications. Its usage is currently spreading across the industry fueled by the decreasing reliability margins induced by the miniaturization and interconnect pitch reduction. (...) This paper will address the control of surface mount under filled assemblies, focusing on applicable inspection techniques and possible options to overcome their limitations.
Career Center | Neenah, Wisconsin USA | Engineering
Are you ready to experience the difference? Plexus Corp. provides comprehensive product development and manufacturing services to Fortune 500 companies in the medical, networking/datacom, high-end computing, industrial and commercial electronics ind
Career Center | Kitchener, Ontario Canada | Engineering,Maintenance,Technical Support
Knowledgeable in Design of Experiments (DOE), Design for Manufacturability (DFM), Statistical Process Control (SPC), Failure Mode & Effects Analysis (FMEA) and Root Cause Analysis that drives continuous improvement in package reliability. A recogniz
Career Center | , | Engineering,Production,Quality Control
SMT EXPERT WITH DOE ,DFM AND LEAN SKILLS
GPD Global | https://www.gpd-global.com/co_website/pcdpumpseries-optimizeddisppath-max.php
. In this case, the multiple "fill" passes must be programmed with a suitable delay between them to all fluid to flow under the device
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_pcb-via-terms-and-applications_topic1596.xml
. Non-Conductive fill is another term for mask plugged vias. Via encroaching: a technique that is often adopted due to concerns about the presenceof solder mask material under the device
