Manufacturer Connectors Custom Molded Copper Cables Custom Plastics Fiber optic Cables Power Supplies Fans & Heat Sinks PDA USB Test Fixtures Fiber Optic Training
Industry Directory | Consultant / Service Provider / Manufacturer
Sewate professionally produce ESD protective packaging systems such as ic shipping tubes, plastic anti static ic tubes,, carrier tape, cover tape and reel, ESD trays for electronic components.
New Equipment | Soldering - Other
Semi-automatic PCB Manual Soldering Machine from SZtech SMT to provide a high-efficient way of the soldering process. It can solve some problems of small soldering. Main specifications of Semi-automatic PCB Manual Soldering Machine Model
New Equipment | Test Equipment
SLIM KIC 2000 SPECIFICATIONS: KIC 2000 Profiler * 9 Channels Slim Kit KIC 2000 Profiler * 9 Channels * Full Original Package, with original Thermal Couples, Protective Shield, Software, etc * Technical Support and Warranty from USA * Thermal Pr
Electronics Forum | Tue Jan 29 22:48:55 EST 2008 | davef
USB Type A Connector Hood We have no relationship, nor receive benefit from the company referenced above.
Electronics Forum | Tue Jan 29 11:37:42 EST 2008 | operator
We have a customer who is using a standard USB Type A Connector on their assemblies. They don't want to add a housing to the assembly, but want to shield the metal USB connector housing from potential shorting with surrounding electronics within thei
Used SMT Equipment | Pick and Place/Feeders
Board size L50 x W50mm to L460 (Max. L1200 OP) x W410mm Board thickness 0.5 to 2.0mm &nb
Used SMT Equipment | Pick and Place/Feeders
FEATURES ▶Higher productivity and quality with printing, placement and inspection process integration▶For larger boards and larger PCBs up to a size of 750 x 550 mm with component range up to L150 x W25 x T30 mm▶Higher area productivity through dual
Industry News | 2003-02-18 09:39:06.0
Encourages You to Submit an Abstract for this Year's Conference
Industry News | 2023-05-27 08:28:25.0
Axial insertion machines are used for components with leads that are parallel to the PCB, while radial insertion machines are used for components with leads that are perpendicular to the PCB.
Parts & Supplies | SMT Equipment
FUJI NTX H04 2.5G FUJI CP3 / CP4 Bore diameter 0.7 / 1.0 / 1.3 Tungsten steel FUJI CP6 / CP7 Bore diameter 0.7 / 1.0 / 1.3 / 1.8 Tungsten steel FUJI CP6 / CP7 Bore diameter 2.5 / 3.7 / 5.0 Tungsten steel FUJI XP141 / 142 Bore diameter 2.5 / 3.7
Parts & Supplies | Assembly Accessories
YAMAHA SMT ORIGINAL USED KHN-M5840-50 Z SERVO BOARD ASSY More SMT parts available 30KW(TOTAL) 3&200v 0~375HZ YS12, YS24 Chassis Servo Board KHN-M5840-525 Servo Control Board (Small Power Servo Board ) KHN-M5840-50 SERVO BOARD ASSY
Technical Library | 2021-05-20 13:41:30.0
Adoption and integration of USB-C chargers and hubs in automotive applications is driving a need for an updated approach to production tests due to USB-C's connector density, high bandwidth, and high power. We introduce a new paradigm in test-system development, micro-FCT (micro Functional Test), and demonstrate developing and deploying of an end-of-line (EOL) functional test-system which meets the strict automotive test requirements for a USB-C hub. Specification to deployment of the test-system was completed in less than 10-weeks, and test cycle time was 1/10th of the customer's requirements
Technical Library | 2020-07-08 20:05:59.0
There is a compelling need for functional testing of high-speed input/output signals on circuit boards ranging from 1 gigabit per second (Gbps) to several hundred Gbps. While manufacturing tests such as Automatic Optical Inspection (AOI) and In-Circuit Test (ICT) are useful in identifying catastrophic defects, most high-speed signals require more scrutiny for failure modes that arise due to high-speed conditions, such as jitter. Functional ATE is seldom fast enough to measure high-speed signals and interpret results automatically. Additionally, to measure these adverse effects it is necessary to have the tester connections very close to the unit under test (UUT) as lead wires connecting the instruments can distort the signal. The solution we describe here involves the use of a field programmable gate array (FPGA) to implement the test instrument called a synthetic instrument (SI). SIs can be designed using VHDL or Verilog descriptions and "synthesized" into an FPGA. A variety of general-purpose instruments, such as signal generators, voltmeters, waveform analyzers can thus be synthesized, but the FPGA approach need not be limited to instruments with traditional instrument equivalents. Rather, more complex and peculiar test functions that pertain to high-speed I/O applications, such as bit error rate tests, SerDes tests, even USB 3.0 (running at 5 Gbps) protocol tests can be programmed and synthesized within an FPGA. By using specific-purpose test mechanisms for high-speed I/O the test engineer can reduce test development time. The synthetic instruments as well as the tests themselves can find applications in several UUTs. In some cases, the same test can be reused without any alteration. For example, a USB 3.0 bus is ubiquitous, and a test aimed at fault detection and diagnoses can be used as part of the test of any UUT that uses this bus. Additionally, parts of the test set may be reused for testing another high-speed I/O. It is reasonable to utilize some of the test routines used in a USB 3.0 test, in the development of a USB 3.1 (running at 10 Gbps), even if the latter has substantial differences in protocol. Many of the SI developed for one protocol can be reused as is, while other SIs may need to undergo modifications before reuse. The modifications will likely take less time and effort than starting from scratch. This paper illustrates an example of high-speed I/O testing, generalizes failure modes that are likely to occur in high-speed I/O, and offers a strategy for testing them with SIs within FPGAs. This strategy offers several advantages besides reusability, including tester proximity to the UUT, test modularization, standardization approaching an ATE-agnostic test development process, overcoming physical limitations of general-purpose test instruments, and utilization of specific-purpose test instruments. Additionally, test instrument obsolescence can be overcome by upgrading to ever-faster and larger FPGAs without losing any previously developed design effort. With SIs and tests scalable and upward compatible, the test engineer need not start test development for high-speed I/O from scratch, which will substantially reduce time and effort.
SLIM KIC 2000 SPECIFICATIONS: KIC 2000 Profiler * 9 Channels Slim Kit KIC 2000 Profiler * 9 Channels * Full Original Package, with original Thermal Couples, Protective Shield, Software, etc * Technical Support and Warranty from USA * Thermal Pr
Sales manager: Mac Xie Mobile: +8618020714662(WhatApp) Email: at@mooreplc.com Skype: +8618020714662 Product Detail 2 USB Connectors 2 Ethernet Connectors 9-Pin Male Connector 15-Pin Female Connector Q&A 1.High quality 2.Prompt Deliver
SMTnet Express, May 20, 2021, Subscribers: 27,111, Companies: 11,359, Users: 26,657 Rapid Deployment of Automated Test-System for High-Volume Automotive USB-C Hub Adoption and integration of USB-C chargers and hubs in automotive
GPD Global | https://www.gpd-global.com/pdf/pbt/PBFT-USB-Upgrade-Kits-Data-Sheet-PBT-118M.pdf
PBFT USB Upgrade Kits Pick a Kit: Which upgrade kit fi ts your older PBFT systems? Just match the connector located on the left side panel of the PBFT with one of the connectors shown below
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types-2020/connectors
). Connector Testing USB connectors now live up to their name of being a truly universal serial lead. USB connectors are expected to reliably work for several years, despite regular insertion and withdrawals that can add up to hundreds of cycles
