WH Depot is an online store for Warehouse equipment and supplies. We have eight branches across Australia with trained and experienced staff dedicated to the sales and service of industrial scales.
The CF-9 Radial Lead Former forms and cuts 2- and 3-leaded taped radial components such as TO-92s, capacitors, transistors, LEDs, etc. - precisely and repeatedly, in standard and special forms. This machine is capable of forming and cutting up to 25
Form & Cut 2-, 3-, 4-, 5-, and 7-leaded Radial Components Capable of forming loose radial components at rates up to 5,000 parts per hour with a variable speed motor. Feed components by hand or with tubes (TO-220s) Reduce setup time with quick ch
Electronics Forum | Tue Jul 12 10:40:27 EDT 2016 | leeg
Brad, have you got any calibration jigs with the machine? This could also be down to laser offset or laser scaling which are both calibrated with different jigs. Where are you based?
Electronics Forum | Tue Oct 21 07:14:40 EDT 2003 | Ciara
Hi, I'm a 3rd year studen doing an electronics project on a digital weighing scales, could someone please tell me any useful websites which contain weighing scales schematics or other useful schematics, any help would be greately appreciated, thank y
SMT Intelligent Feeder Calibration Jigs CAN Install Different Brands Feeder Product Specifications/Features Name of commodity: intelligent Feeder calibration jigs Weight :45KG (net weight) the size of goods (mm): L540*W350*H600 Power sup
Industry News | 2016-06-22 15:33:28.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2016 Global Frost & Sullivan Award for Growth Excellence Leadership. Heller Industries has made remarkable improvements to its product and technology portfolios over the last 10 years to emerge a top participant in the SMT reflow soldering equipment market.
Industry News | 2012-08-13 14:31:01.0
Europlacer announces that its 2012 International Sales Meeting, which was held in June, was a resounding success.
40024270 Magnet IC Scale YB use For JUKI FX-1(FX-1R) Smt Machine 40000740 PLASTIC RAIL ASSY(Y AXIS) 1 40058017 ENERGY CHAIN X 1 40069117 CABLE BEAR ASSY 1 40046022 Y CABLE BEAR 1 40060210 Y CABLE BEAR(E) 1 40008069 X AXIS PLASTIC RAIL C
Description: 1, Original Place: China 2, Part name Name: IC Tray 3, Size: 330X310 4, Weight: 4KG 5, packaging: Original Pack 6, MOQ: 1 piece 7, Used for JUKI JUKI smt parts: JUKI SL710-0080L0019 PN: 40003273 40003274 Magnescale JUKI 2050
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Technical Library | 1999-08-27 09:29:49.0
Contract packaging houses have to contend with a large mix of die types and products. Flexibility and quick turnaround of package types is a must in this industry. Traditional methods of die encapsulation, (i.e., use of transfer-molding techniques), are only cost effective when producing a large number of components. Liquid encapsulants now provide similar levels of reliability1, and are cost effective...
http://www.gpd-global.com This amazing taped Radial components is capable of forming a variety of forms including flushmount, standoff, and lock-in (dependent on inserted dies). Find out more http://www.gpd-global.com/co_website/leadformers-cf9.php
Jetting enables simultaneous underfill of top & bottom levels of Package-on-Package applications. Shown jetting with the DispenseJet DJ-9000. http://www.nordsonasymtek.com
Career Center | Erode, Tamilnadu India | Engineering
Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou
SMT Express, Volume 2, Issue No. 6 - from SMTnet.com Volume 2, Issue No. 6 Wednesday, June 14, 2000 Featured Article Return to Front Page Process Control for Solder Flux Stacy KaliszMark OwenMVTechnology Ltd. ABSTRACT Flux used in ball grid
Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes Leadless, near chip scale
Feature:Fixed an issue where the print PDF feature was only printing the page Header3D STEP:TO220 Vertical – Fixed issues with the 3D Model generation when D1 exceeded DLCC component family STEP Model generation modified so that the pin 1 marker scales better for smaller parts with pin 1 at the edges
. A component is aligned in the shuttle and transported into position to the fi rst of three die sta- tions. The vertically adjustable die stations feature standard micrometer scales with display incre- ments to 0.001” (0,025 mm