Industry News: uv cure oven (Page 1 of 63)

Heller Industries Opens New Office and Demo Center in Taoyuan, Taiwan

Industry News | 2023-03-30 22:45:02.0

Taoyuan, Taiwan (February 27, 2023) – Heller Industries, a leading provider of reflow and curing ovens for SMT and semiconductor advanced packaging, today announced the opening of a new office in Taoyuan, Taiwan, to meet the growing demand for reflow and curing equipment in the Taiwan region.

Heller Industries Inc.

Heller Industries Will Feature the MK7 Reflow Oven Featured at IPC APEX 2022 Booth #1920

Industry News | 2021-11-08 14:38:39.0

Heller Industries, a leading supplier of reflow soldering ovens for electronic manufacturing and pressure curing ovens for back-end semicondutor manufacturing, today announced they will be exhibiting their new MK7 reflow oven at the San Diego Conference Center January 25-27, 2022.

Heller Industries Inc.

Heller Industries Mark 5 Wins 2012 VISION Award

Industry News | 2012-05-11 20:35:45.0

Heller Industries has been awarded a 2012 SMT VISION Award in the category of Soldering Reflow for its 1936 Mark 5 Reflow Oven. The award was presented on April 25, 2012 at the Nepcon China Exhibition.

Heller Industries Inc.

Heller Industries Proud Recipient of 2021 Service Excellence Award for Soldering Equipment

Industry News | 2021-04-14 10:42:33.0

The 2021 Service Excellence Award for Soldering Equipment was given to Heller Industries. Circuits Assembly recognizes companies that receive the highest customer service ratings, as judged by their own customers.

Heller Industries Inc.

HELLER Appeared at CEIA Wuhan Seminar

Industry News | 2023-06-12 21:13:08.0

HELLER joined the 97th CEIA China Electronics Intelligent Manufacturing Summit Forum convened in Wuhan, garnering substantial attention from industry insiders. The conference concentrated on a wide array of fields, including optoelectronic communication, military electronics, and EV automotive electronics. With an impressive turnout of nearly 500 industry colleagues, the event proved to be an invaluable platform for networking and knowledge exchange.

Heller Industries Inc.

Lean Stream & Heller Reflow Technology to Partner in CA & NV

Industry News | 2015-11-12 22:03:28.0

Heller Industries is thrilled to announce that we've partnered with the #1 Northern California Sales Representative Group - Lean-Stream!

Heller Industries Inc.

Heller Industries Commended by Frost & Sullivan for Delivering Unmatched Customer Value through Its Reflow Soldering Technology

Industry News | 2019-12-09 14:44:26.0

The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.

Heller Industries Inc.

SMT Soldering Equipment Reflow Tool for Industry 4.0 - Frost & Sullivan Award

Industry News | 2017-09-16 02:29:39.0

Heller Industries has been awarded the 2017 Global Frost & Sullivan Company of the Year Award for its surface mount technology (SMT) soldering equipment that enables Industry 4.0. - the automation and data exchange in manufacturing technologies.

Heller Industries Inc.

Select the Perfect PCBA Coating Machine Line

Industry News | 2024-04-09 11:59:08.0

Choosing the optimal equipment for your PCB coating line is pivotal for operational success. This guide navigates through the integral components of a standard PCBA coating machine line and their efficacy in addressing common challenges. We delve into the composition of the line, encompassing the elevator, transfer station, coating machine, inspection station, curing oven, and the cohesive system facilitated by a return conveyor.

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Nordson ASYMTEK Showcases 2-Component Large-Volume and Precision Dispensing and Coating Systems at SMT Nuremberg

Industry News | 2018-06-03 19:35:57.0

Nordson ASYMTEK will showcase a powerful array of dispensing and conformal coating systems and valves at SMT Nuremberg 2018, Nuremberg Germany, from June 5-7, in the SMARTec stand 4-401. In addition, the Spectrum™ II S2-900 precision fluid dispensing system and the Thermal Cure TC-2400 for curing underfill will be demonstrated in the Future Packaging line at Stand 5-434.

ASYMTEK Products | Nordson Electronics Solutions

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