GPD Global | https://www.gpd-global.com/fluiddispense-appsol-flipchipassembly.php
. Fill Pass Patterns Fillet Pass Depending on die size, this pass could be all the material required to complete the underfill. Once the material is dispensed, it flows under the flip chip via capillary action
GPD Global | https://www.gpd-global.com/capillary-underfill-dispensing.php
. Fill Pass Patterns Fillet Pass Depending on die size, this pass could be all the material required to complete the underfill. Once the material is dispensed, it flows under the flip chip via capillary action
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_05_19_10.pdf
eptac_05_19_10.PPT 1 Welcome to the EPTAC Webinar Series: IPC 2010 APEX Conference and IPC-A-610E, J-STD-001E, IPC-A-600H You are connected to our live presentation delivered via the internet
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/proportional-throughhole-padstacks_topic90_post64.html
0.4mm has a pad size of 1.00mm whilst in the VIA chart, a 0.4mm hole has a pad size of between 0.65mm and 0.8mm. I realise there is no solder fillet required on a via but have been tearing what little there is left of my hair out trying to figure out how the VIA pad is calculated and if it is defined anywhere in IPC
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/proportional-throughhole-padstacks_topic90_post1530.html
0.4mm has a pad size of 1.00mm whilst in the VIA chart, a 0.4mm hole has a pad size of between 0.65mm and 0.8mm. I realise there is no solder fillet required on a via but have been tearing what little there is left of my hair out trying to figure out how the VIA pad is calculated and if it is defined anywhere in IPC
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/proportional-throughhole-padstacks_topic90_post1532.html
0.4mm has a pad size of 1.00mm whilst in the VIA chart, a 0.4mm hole has a pad size of between 0.65mm and 0.8mm. I realise there is no solder fillet required on a via but have been tearing what little there is left of my hair out trying to figure out how the VIA pad is calculated and if it is defined anywhere in IPC
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/proportional-throughhole-padstacks_topic90_post1476.html
0.4mm has a pad size of 1.00mm whilst in the VIA chart, a 0.4mm hole has a pad size of between 0.65mm and 0.8mm. I realise there is no solder fillet required on a via but have been tearing what little there is left of my hair out trying to figure out how the VIA pad is calculated and if it is defined anywhere in IPC
| https://www.eptac.com/soldertips/soldertips-issues-with-incomplete-solder-reflow-in-production-2/
. Is the incomplete reflow of solder paste as per Section 5.2.3 of IPC-A-610 a defect requiring rework even if the fillet appears to meet IPC standards? Answer
| https://www.eptac.com/soldertip/soldertips-issues-with-incomplete-solder-reflow-in-production-2/
5.2.3 of IPC-A-610 a defect requiring rework even if the fillet appears to meet IPC standards? Answer: I’m not exactly sure of what you mean by flux exhaustion, however
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-issues-with-incomplete-solder-reflow-in-production-2
5.2.3 of IPC-A-610 a defect requiring rework even if the fillet appears to meet IPC standards? Answer: I’m not exactly sure of what you mean by flux exhaustion, however
