Electronics Forum | Fri Oct 05 07:31:29 EDT 2001 | furrer
When tenting vias almost a few vias are not covered completly by Solder Mask. Does this one side open vias affect the Immersion Tin Process ? Do we get chemical residues in the vias ?
Electronics Forum | Sat Oct 06 08:27:24 EDT 2001 | davef
Yes, some solder masks do not tent well, because the material is too thin. That�s the trade-off. Thin masks: * Conform well to [don't bleed onto] fine pitch features. * Tent vias poorly, requiring an additional "plugging" step. As you imply, if th
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Via Tent-Holes with Solder Mask
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1.Vias near SMD pads: Solder can flow into the via after melted. As a result cold joint will appear in the end. Check the picture below. 2.Vias on SMD pads: Solder can flow into the via more easier after melted. Check the picture below. 3.Via opening without soldermask covered. When workers solder TH parts by hand, soldering iron can touch vias sometime, then tiny amounts molten solder will stay on vias. This can lead to electrical short easily. We recommend you make all vias tenting (covered by solder mask) if it is possible.
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. The typical form for such a profile, Figure 1b, is commonly referred to as a “tent” or “straight ramp” profile. For no- clean pastes, which have less active fluxes, excessive dwell time serves only to deplete the flux before reflow
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