The Vitronics Soltec XPM3 product platform is the latest evolution in a long history of reflow systems that have proven their capability worldwide and established a reputation for superior reliability. Robust design combined with a unique heat transf
Vitronics Soltec XPM3-1030 Reflow Oven Max. Width of PCB 450mm Heating zones: 10 Heating method: Hot Air Conveyor speed 0-2000mm/min Product description: Vitronics Soltec XPM3-1030 Reflow Oven Edge/Mesh belt, 10 zone, Dimension(L*W*H) 5200&tim
Electronics Forum | Wed Apr 11 12:17:05 EDT 2018 | randywoods
I need to perform maintenance. On reflow oven. I do not remeber procedure for opening. Hood for reflow oven. Vitronis Soltec XPM2.
Electronics Forum | Thu Apr 12 09:06:25 EDT 2018 | deanm
If its like our XPM3i there is a keyswitch on the right hand side of the console above the keyboard.
“Sealed Bid” Auction Bidding Opens On February 9, 2015 At 8AM EST Bidding Closes On February 24, 2015 Promply At 5PM EST ** This Is Not An Ebay Style Auction ** ** It Is A Sealed Bid Auction ** ** Bidders Should Submit Maximum Bids When Ente
2008 Vitronics Soltec XPM2-730 Reflow Oven Power: 220V; 50/60Hz; 3 Phase Direction: Left to Right Serial: X2A72005 Features: 7 Zones (Top & Bottom Heaters) OS: Windows XP; S/W: 3.2.0 Lead-Free Compatible; Auto Width Adjust Combo Mesh Belt / Pi
Industry News | 2021-06-08 09:22:40.0
Baja Bid is hosting an online auction event featuring items from: Mydata, DEK, Vitronics, Universal and much more. The bidding period began yesterday, June 7, at 8:00am EST. The bidding period will begin closing tomorrow, June 9, at 1pm EST.
Kh5-m8501-00x gas pressure switch Koganei 300v-03 Kh5-m8501-00x gas pressure switch Koganei 300v-03 HELLER 1707 HELLER 1707, SMT 7Heat Zone Mid Size Reflow Oven, CNSMT HELLER 1707MKIII HELLER 1707MKIII, SMT 7Heat Zone Mid Size Reflow Oven, CNSMT
Technical Library | 2011-08-04 19:29:53.0
This work covers two major projects aimed at increasing quality and efficiency on a high mix, low volume surface mount electronics production line. Specifically the installation of a ten zone reflow oven and an enhanced changeover method for SMT pick and
Technical Library | 2013-08-29 19:52:43.0
Au over Ni on Cu is a widely used printed circuit board (PCB) surface finish, under bump metallization (UBM), and component lead metallization. It is generally accepted that less than 3 wt.% Au in Sn-Pb solder joints inhibits formation of detrimental intermetallic compounds (IMC). However, the critical limit for Au content in Pb-free solder joints is not well established. Three surface-mount package platforms, one with a matte Sn surface finish and the others with Ni/Au finish, were soldered to Ni/Au-finished PCB using Sn-3.0Ag 0.5Cu (SAC305) solder, in a realistic manufacturing setting. The assembled boards were divided into three groups: one without any thermal treatment, one subjected to isothermal aging at 125°C for 30 days, and the third group aged at 125°C for 56 days...
Career Center | Obour, Egypt | Engineering,Maintenance,Production
Ten years of experience in electronics assembly work for Toshiba Egypt and Iskraemeco Egypt • Researched, analyzed and selected production equipment. • Work within team to startup Iskraemeco’s new factory in Egypt. • L
Vitronics Soltec XPM 820 Reflow Oven - Lewis and Clark Skip to content My Cart: 0 View Cart Checkout No products in the cart
. has over 20 years of experience with XPM3i, XPM3, XPM2+, XPM2, XPM, Unitherm, Magnathem, Isotherm, Acrotherm, Radiantherm, and SMD models of Vitronics Soltec reflow ovens