New Equipment | Rework & Repair Services
Reliable LGA Rework Services to Rescue Your Project BEST is your source for LGA rework services. We can optimize our processes to make sure voiding is minimized and the interconnection to all of the IO meets the IPC classification for the assembly.
New Equipment | Solder Paste Stencils
Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o
Electronics Forum | Tue Sep 04 02:28:17 EDT 2007 | philip_yam
Any one has experience over solder voids in oscillator capacitor joint could result in high phase noise during the digital performances test? The noise signal was gone after solder touch up. What could be the root cause of the high phase noise?
Electronics Forum | Tue Sep 04 10:27:33 EDT 2007 | rgduval
I haven't experienced this problem, exactly, but I have had issues with noise in digital circuits that appear to have gone away with touch up. The problem was that the customer blamed the noise issue on the solder quality, and he pointed to the fact
Industry News | 2003-06-10 08:16:44.0
The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.
Industry News | 2012-10-16 18:56:39.0
IPC — Association Connecting Electronics Industries® will hold “IPC Conference on Solderability and Reliability for Electronics Assemblies” on 6-7 February 2013, in Budapest, Hungary.
Technical Library | 2020-01-28 00:23:58.0
This paper explores new advances in the reflow soldering process including vacuum technology and warpage mitigation systems. The first topic for discussion will be the implementation of a vacuum process directly in a conventional inline soldering system. The second topic presented is the mitigation of warpage on substrates or wafers.
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Wed Mar 08 00:00:00 EST 2017 - Wed Mar 08 00:00:00 EST 2017 | San Diego, California USA
San Diego Chapter - Minimizing Voiding in Bottom-Terminating Components
Events Calendar | Mon Dec 02 00:00:00 EST 2019 - Mon Dec 02 00:00:00 EST 2019 | ,
Webinar: QFN/LGA Design, Assembly Process Issues & Reliability Failures
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/lga-incorrect_topic2691_post10984.html
: 44 Post Options Post Reply Quote phil.holden Report Post Thanks(0) Quote Reply Topic: LGA Incorrect Posted: 01 Oct 2020 at 8:58am Yes it works in the PQFN category
| http://etasmt.com/cc?ID=te_news_bulletin,23577&url=_print
Key Advances in Void Reduction-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Reflow oven,SMT Reflow Soldering Oven 当前位置: Home >> News >> News Key Advances in Void Reduction Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum This paper explores new advances in the reflow soldering process
