New SMT Equipment: voiding and cures (Page 1 of 2)

860 Pressure Curing Oven (PCO)

860 Pressure Curing Oven (PCO)

New Equipment | Curing Equipment

A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with

Heller Industries Inc.

IPC 6012C Qualification and Performance Specification for Rigid Printed Boards

IPC 6012C Qualification and Performance Specification for Rigid Printed Boards

New Equipment | Education/Training

This specification covers qualification and performance of rigid PCBs including with or without plated-through holes, single-sided, double-sided, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surfac

BEST Inc.

Henkel CSP and BGA Underfills

Henkel CSP and BGA Underfills

New Equipment | Materials

Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance

Henkel Electronic Materials

Reflow and Curing Ovens

Reflow and Curing Ovens

New Equipment |  

Near Equilibrium Hot Gas Heating makes the CUREFLOW series the only choice for SMT Convection reflow and curing applications. 3 models to choose from.

ETS, LLC

RDS Curing and Drying Systems

New Equipment | Curing Equipment

For curing and drying requirements, rehm�s RDS series is available with completely customized heating and cooling lengths. Our modular design concept allows us to outfit the RDS with any combination of heating (Convection and/or IR), cooling, and UV

Rehm Thermal Systems Korea Limited

Henkel Loctite Gaskets and Sealants

Henkel Loctite Gaskets and Sealants

New Equipment | Materials

25 Sealants LOCTITE 5210 One-component ultra fast curing, non-corrosive RTV silicone designed for potting, wire tacking, selective sealing, vibration dampening and repair/rework applic

Henkel Electronic Materials

long wave infrared reflow and curing ovens

New Equipment |  

IC'S, Hybrids SMT Silver glass curing BGA reflow Gold/tin reflow Package sealing with N2H2

ROBOTHERM

UV Curable Glob Top and Dam-and-Fill Encapsulants

UV Curable Glob Top and Dam-and-Fill Encapsulants

New Equipment | Materials

For encapsulation of wirebonded IC’s Zymet's glob top and dam-and-fill encapsulants are UV curable, yet they have properties similar to conventional heat cured encapsulants, high Tg’s and low CTE’s. With UV cure, curing is performed quickly, inline

Zymet, Inc

IPC 6012D Qualification and Performance Specification for Rigid Printed Boards

IPC 6012D Qualification and Performance Specification for Rigid Printed Boards

New Equipment | Other

IPC 6012 Qualification and Performance Specification for Rigid Printed Boards This specification covers qualification and performance of rigid PCBs including with or without plated-through holes, single-sided, double-sided, multilayer with or withou

soldertools.net

KIC Vision² Periodic Automatic Profiling for Reflow and Curing Ovens

KIC Vision² Periodic Automatic Profiling for Reflow and Curing Ovens

New Equipment | Reflow

Eliminate manual periodic profiling KIC Vision² utilizes temperature and speed sensors embedded in the oven for consistent and accurate profile measurements of the processed PCB Programming and Frequencies A single manual profile run wit

KIC Thermal

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Best SMT Reflow Oven

World's Best Reflow Oven Customizable for Unique Applications
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