Industry News: vp 3000 (Page 1 of 2)

CyberOptics’ 3D AOI System Honored with Innovation Award for Unmatched Speed and Accuracy

Industry News | 2015-04-22 14:57:26.0

CyberOptics® Corporation (NASDAQ: CYBE) announces that it has been awarded a 2015 EM Asia Innovation Award in the category of Test & Measurement / Inspection Systems – AOI for its new SQ3000™ 3D Automated Optical Inspection (AOI) system. The award was presented to the company during an April 22, 2015 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China. The 2015 EM Asia Innovation Award is CyberOptics’ 20th industry award from the electronics industry.

CyberOptics Corporation

Endicott Interconnect Technologies, Inc. Introduces New LCP Laminate Product Offering

Industry News | 2010-12-03 22:31:01.0

Endicott Interconnect Technologies, Inc. (EI) announced today that the Company has added Liquid Crystal Polymer (LCP) Laminates to its family of microelectronics packaging product offerings.

i3 Electronics

CyberOptics to Showcase High-Precision Inspection and Metrology Solutions at the SEMI Connecting Heterogeneous Systems Summit

Industry News | 2021-08-13 12:16:35.0

CyberOptics® Corporation (NASDAQ: CYBE) will feature the WX3000™ metrology and inspection system with MRS™ sensor technology, and high-precision sensors for semiconductor tool set-up and diagnostics at the VirtualConnecting Heterogeneous Systems Summit Sept. 1-3, 2021.

CyberOptics Corporation

CyberOptics to Present '100% Wafer Bump Metrology and Inspection' Technical Paper at the SEMICON Taiwan SiP Global Summit 2020

Industry News | 2020-09-06 04:37:56.0

CyberOptics® Corporation (NASDAQ: CYBE) will present at the SEMICON Taiwan Global SiP Summit on September 24, 2020 at 4:20pm. Tim Skunes, VP of R&D at CyberOptics, will share the technical presentation 'Fast, 100% 3D Wafer Bump Metrology and Inspection to Improve Yields and 3D System Integration'.

CyberOptics Corporation

CyberOptics to Present Technical Paper'Fast, 100% Wafer Bump Metrology and Inspection' at Virtual IEEE PAINE Conference

Industry News | 2020-11-18 15:38:26.0

CyberOptics® Corporation (NASDAQ: CYBE) will present at the Virtual IEEE International Conference on Physical Assurance and Inspection of Electronics (PAINE) on December 16th at 8:00amCT.

CyberOptics Corporation

Cimmetry and Valor Team Up

Industry News | 2001-11-13 06:07:29.0

to Provide ODB++(X) Support within AutoVue

Valor Computerized Systems

Green Manufacturing Expo Introduced

Industry News | 2007-06-11 18:52:56.0

Los Angeles, CA (June 5, 2007) – Canon Communications LLC, the leading producer of trade events serving the nation's $1 trillion advanced manufacturing

UBM Canon

Leading EMS Provider Creation Technologies Expands Into Mexico

Industry News | 2012-10-03 07:35:49.0

Manufacturer Purchases Electronics Company in Mexicali to Expand its Offering to Customers

Creation Technologies

Creation Technologies Named EMS Company of the Year

Industry News | 2012-12-12 14:02:30.0

Leading Electronics Manufacturing Magazine, Circuits Assembly, Recognizes North American EMS Provider

Creation Technologies

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