New Equipment | Industrial Automation
Sandy.[mailto:unity@mvme.cn] Sandy.[WhatsApp/Skype/Mobile:+8618020776786] Sandy.[Quote to you within the shortest possible time with our best price] Warranty: up to 12 months Shipping: fast delivery is available NEW+ORIGINAL+IN STOCK+ONE
PRO 1600-RS is specifically configured for reflow simulation and thermal stress testing applications. This includes Preconditioning of Nonhermetic Surface Mount Devices (SMD) per JESD22-A113F standard, Moisture Sensitivity Level (MSL) testing of semi
Electronics Forum | Thu Jul 09 15:17:48 EDT 2015 | goodting
Thanks for the inquiry. We used MCD (Motion Control Dia) tool to verify if that is caused by VRM board. No respond(I means the related axis was off) was detected. we swapped that board to other machine, the VRM card was good.... X axis was stopped, t
Electronics Forum | Thu Jul 16 15:09:27 EDT 2015 | goodting
Can anyone tell what Axis controller and VRM-MC board does in GSM machine? Regards
Used SMT Equipment | Pick and Place/Feeders
* Universal Genesis Gi-14 * Dual Gantry VRM Linear motor positioning * Dual FlexJet3 7 spindle placement heads * Magellan Digital Upward looking camera * PrecisionPro quick change feeder bases * Large Board Kit option 25"x 20" x .200" * UPS+ Wi
Used SMT Equipment | Pick and Place/Feeders
Configuration Model: 4993B (PC based VME.) Single Beam - Lightning Head NPI qty.2 Nozzle changers Specifications Machine Type: Gantry Number of Gantries: 1 Drive System: Dual Linear Motor X,Y Motor Type: VRM Linea
Industry News | 2009-12-14 21:32:34.0
Vicor, a leader in the development, manufacture and sale of power conversion components and systems since 1981, has purchased Universal Instruments’ Genesis Platform based on its unique ability to adapt to a wide range of process requirements. The new equipment will be used for Vicor’s leading-edge VI Chip line of power conversion products, from low-volume/high-mix, to high-volume, as well as a specialized post-SMT assembly process requiring unique tooling and software solutions. Universal’s ability to provide a complete turn-key solution, rather than the hardware alone, differentiated Genesis from the alternative providers.
Industry News | 2010-02-08 12:43:30.0
Altech UEC is a leading developer of digital technology for the International Pay-TV Industry. The company has chosen Universal Instruments’ Genesis Platform to be used in manufacturing its leading-edge Digital Terrestrial Television (DTT) Set Top Box (STB) products. Initial production results have shown a dramatic performance improvement from 55,000 components to 99,000 components per hour.
Parts & Supplies | Assembly Accessories
UNIVERSAL 17733000 PC BD Fit ASM UNIVERSAL 17733000 PC BD Fit ASM UNIVERSAL SMT PART PCB 10525162 | PCB 1445-012 UNIVERSAL PCB 23928000 INTF Pb INTL UNIVERSAL DISPLAY PCB CARD 25410071 UNIVERSAL SHUT SW ASSY REV A PCB 24677000 UNIVERSAL PCB 25
Parts & Supplies | Assembly Accessories
UNIVERSAL SMT PART PCB 10525162 | PCB 1445-012 UNIVERSAL PCB 23928000 INTF Pb INTL UNIVERSAL DISPLAY PCB CARD 25410071 UNIVERSAL SHUT SW ASSY REV A PCB 24677000 UNIVERSAL PCB 25327000 DISPLAY DRIVER 2 REV D UNIVERSAL PCB 40958701 SEQ DV 4 ASSY
Technical Library | 2024-07-24 00:51:44.0
A blade server system (BSS) utilizes voltage regulator modules (VRMs), in the form of quad flat no-lead (QFN) devices, to provide power distribution to various components on the system board. Depending on the power requirements of the circuit, these VRMs can be mounted as single devices or banked together. In addition, the power density of the VRM can be high enough to warrant heat dissipation through the use of a heat sink. Typically, at field conditions (FCs), the BSS are powered on and off up to four times per day, with their ambient temperature cycling between 258C and 808C. This cyclical temperature gradient drives inelastic strain in the solder joints due to the coefficient of thermal expansion (CTE) mismatch between the QFN and the circuit card. In addition, the heat sink, coupled with the QFN and the circuit card, can induce additional inelastic solder joint strain, resulting in early solder joint fatigue failure. To understand the effect of the heat sink mounting, a FEM (finite element model of four QFNs mounted to a BSS circuit card was developed. The model was exercised to calculate the maximum strain energy in a critical joint due to cyclic strain, and the results were compared for a QFN with and without a heat sink. It was determined that the presence of the heat sink did contribute to higher strain energy and therefore could lead to earlier joint failure. Although the presence of the heat sink is required, careful design of the mounting should be employed to provide lateral slip, essentially decoupling the heat sink from the QFN joint strain. Details of the modeling and results, along with DIC (digital image correlation) measurements of heat sink lateral slip, are presented.
SMT, Pick and Place, Universal Instruments, Juki, Panasonic Factory Automation, Chipshooter, Lightning head, PCB, Reflow Oven, Model GC30s
Career Center | Round Rock, Texas USA | Management,Production,Purchasing
With Supply Chain and manufacturing management experience that includes startups, turnarounds and major growth initiatives for high-tech electronics firms, I have significant accomplishments in building and efficiently running companies. If your firm
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