We are a manufacturer of low maintenance small vacuum pump from Germany for semiconductor industry use in vacuum chuck, vacuum tweezer, vacuum packing, chip mounter, wafer handling, pick and place.
Industry Directory | Manufacturer
a leading manufacturer of wafer handling tools for the global semiconductor industry. Our products include vacuum wands, wafer tweezers, HEPA vacuum pumps, etc. ESD safe products and tools for 300mm wafers are also available.
New Equipment | Board Handling - Storage
Manual Wand for Semiconductor Wafer Handling Handle a fragile semiconductor silicon wafer softly but firmly without excessive touch. The surfaces of a wafer are never scratched in contrast to conventional metal tweezres. Our unique design (Pat
New Equipment | Board Handling - Storage
A vacuum wand is a tool for gripping and holding a delicate miniature object securely without touching it with your hand. (cannot inhale like a vacuum cleaner!!) This means the object is not damaged. A vacuum pump connected to the wand body provides
Electronics Forum | Fri Aug 08 13:31:37 EDT 2008 | RobP
We have a customer that wants us to quote a project placing 12x12 mil dies in large volumes. I can not find feeders for my pick-and-place equipment that will handle wafers with dies that small. Thus, I'm now looking to go to a die sorter to put the
Electronics Forum | Thu Aug 02 21:22:15 EDT 2018 | davef
I need your input. What are your thoughts? Currently SMTnet is looking to improve process. It uses four different lists of categories that all are maintained and updated separately. A single LIST makes sense. Approaches to arranging the LIST being
Used SMT Equipment | General Purpose Equipment
ASM MS899-DL Wafer Mapping Die Sorter Machine is in like new condition! Serial Number: MS899DL-01817-0402 Model Number: MS899-DL Year 2008 August Cycle Time: 175 ms XY Placement: +/- 1.5 mil Die Rotation: +/- 3 degrees Collect type: Surfa
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Used SMT Equipment | Pick and Place/Feeders
Ultra High Vaccuum Cleanroom Jumbo-Robot for Semiconductor handling + Controller Serial Number: NA ----------------------------------- Lot located in our warehouse in Dresden, Sachsen Germany
Industry News | 2012-08-02 11:47:58.0
The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 9th Annual International Wafer-Level Packaging Conference.
Industry News | 2016-08-23 16:25:55.0
The SMTA and Chip Scale Review magazine are pleased to announce the Workshops for the 13th Annual International Wafer-Level Packaging Conference (IWLPC). On Thursday, October 20, there will be professional workshops given by instructors who are pre-eminent authorities in their fields. IWLPC will be held October 18-20, 2016 at the DoubleTree Airport Hotel in San Jose, California.
Parts & Supplies | Assembly Accessories
Detailed Product Description Part Number: L809E0210A0 Brand: Mitsubishi Part Name: Y Axis Motor Power: 750W Original: Japan Model: HC-MFS73-S14 750 Watt JUKI FX-1 Y Axis Motor HC-MFS73-S14 JUKI Servo Motor L809E0210A0 1. For JUKI FX1 SMT Machine
Parts & Supplies | Assembly Accessories
FX-1 Y Axis Motor HC-MFS73-S14 We are Supply SMT Pick and Place Equipment spare parts(Smt nozzle, Smt Cylinder, Smt Valve, Smt Sensor, Smt Feeder, Smt CPU Board, Smt Laser, Smt driver, Smt ejector……) for Yamaha, JUKI, FUJI ,Panasonic, Samsung …… b
Technical Library | 2016-08-11 15:49:59.0
The challenge for 3D IC assembly is how to manage warpage and thin wafer handling in order to achieve a high assembly yield and to ensure that the final structure can pass the specified reliability requirements. Our test vehicles have micro-bumped die having pitches ranging from 60um down to 30um. The high density of pads and the large die size, make it extremely challenging to ensure that all of the micro-bump interconnects are attached to a thin Si-interposer. In addition, the low standoff between the die and interposer make it difficult to underfill. A likely approach is to first attach the die to the interposer and then the die/interposer sub-assembly to the substrate. In this scenario, the die/interposer sub-assembly is comparable to a monolithic silicon die that can be flip chip attached to the substrate. In this paper, we will discuss various assembly options and the challenges posed by each. In this investigation, we will propose the best method to do 2.5D assembly in an OSAT(Outsourced Assembly and Test) facility.
This video describes the features of BTU's Pyramax™ convection reflow oven, including the new dual-lane, dual-speed feature which essentially gives one oven the capability of two ovens. Pyramax ovens are known worldwide for superior reliability, unm
The FINEPLACER® Lambda, a modularly designed bonder, provides a full range of process capabilities and multiple bonding technologies. Read more: http://eu.finetech.de/micro-assembly/products/fineplacerr-lambda.html
Career Center | Melbourne, Florida USA | Management,Production,Quality Control
Technical Skills/Abilities: � Management � Quality Assurance � Strong Troubleshooting Skills � Strategic Planning � Employee Training � Quality Assurance � Problem Resolution � Mechanical/Technical Aptitude
Career Center | Cavite, Philippines | Engineering,Technical Support
I had 15 years Handling SMT Equipment.
Screen and Stencil Printing Processes for Wafer Backside Coating News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing! Screen and Stencil Printing Processes for Wafer Backside
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/dage/wafer-inspection-and-metrology
Point-and-Click-Steuerungssoftware auf Fehler im Submikrometerbereich. Quadra W8 hat alles, was Quadra 7 auch hat, alle Leistungen und Vorteile plus integriertes Wafer-Handling. Bediener
GPD Global | https://www.gpd-global.com/pumps-wafer-dispensing-mems.php
. Example of a Wafer component. Wafer Fixturing in Stand-alone System. For automated processing, we can interface with our wafer handling system to feed wafers, with or without frames, directly from magazines
