Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti
Jetting Simplified Jetting pumps are excellent for dispensing small volumes of fluid at high rates of speed. The NCM5000 simplifies jetting to its basic elements - this means easy set up, cleaning, and maintenance for you. The drive system is design
Electronics Forum | Wed Oct 27 19:50:59 EDT 1999 | chris
Hi What is the possible cause of non-wetting of solder paste to the gold land pad. What we observed in the surface of the non-wet pad is an organic FM, and using FTIR we found out that it is a flux. It is possible that the cause of non-wetting is
Electronics Forum | Tue Sep 01 11:30:28 EDT 2009 | rgduval
Is the solder wetting to the pad, and not to the part? If so, and all other things being true (same process, profile, solder), we'd suspect some contamination on the part preventing solder from wetting to the part. This could be tested by attemptin
DEK 03IX automatic solder paste printing machine features advanced up/down k-view vision system, independent control and adjustment of lighting, high-speed moving lens, accurate alignment of PCB PCB and net board. The DEK Horizon 03IX automatic solde
Input Power: 120VAC Features: Silver Camera, Understencil Wipe(dry, wet, or vacuum) , 29”x29” Stencil, Edge Clamp, set of squeeges with blades Soft Copy of User Manual, Technical Manuals and Diagrams Complete and Operational 30 Day Parts Excha
Industry News | 2013-07-22 09:54:27.0
GPD Global has introduced its new NCM5000 dispense pump for easy jetting. With only two wetted parts and no seals or springs to replace or adjust, field operation is simple.
Industry News | 2016-05-10 14:16:16.0
GPD Global offers individual pumps for integration into your existing platform – the Jetting NCM5000 Pump is one of them. The Jetting NCM5000 Pump simplifies jetting to its basic elements: hammer, pin, and nozzle. Only the pin and nozzle are wetted parts. This means easy set-up, cleaning, and upkeep.
SMT MACHINE SPARE PARTS JUKI RS-1 NOZZLE ASSEMBLY 7505 40183425 JUKI Nozzle Specifications: Brand Name JUKI RS-1 NOZZLE Part Number 40183425 Model JUKI NOZZLE 7502 7503 7504 7505 7506 Ensure Test in machine confirmation Guarantee 1 month
ORIGINAL SMT SPARE PARTS JUKI 2040 ZT DRIVER E9627729000 TA8074N4E2 JUKI Nozzle Specifications: Brand Name JUKI DRIVER Part Number E9627729000 Model Number TA8074N4E2 Ensure Tested buy juki Guarantee 1 month usage for machine JUKI KE2040
Technical Library | 2019-06-11 09:36:13.0
An experiment was recently performed ACI Technologies for a customer that was interested in comparing the wetting of lead-free solders with varying temperature profiles and atmospheric conditions. In order to deliver an objective measurement of solder wetting (in addition to subjective inspection analysis), a simple wetting indicator pattern was added to the solder stencil in an area on the test vehicle that had exposed and unused copper.
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
http://www.gpd-global.com This high speed Simplified Jetting Pump consists only two wetted parts, very easy to setup and clean. Efficient. NCM5000 Jetting pump dispenses surface mount glue / adhesive with excellent result. Watch this video. More In
http://www.gpd-global.com Tilt-and-Rotate configuration is available. Full featured programming makes conformal coating processes quick and easy. 3-axis Conformal Coating System for printed circuit boards that provides a reliable robotic platform f
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The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
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SMTnet Express, November 19, 2017, Subscribers: 30,938, Companies: 10,768, Users: 23,942 To Quantify a Wetting Balance Curve Frank Xu Ph.D., Robert Farrell, Rita Mohanty Ph.D.; Enthone Wetting balance testing has been an industry standard
. With only two wetted parts and no seals or springs to replace or adjust, field operation is simple. The NCM5000 pump uses a reliable, high-speed pneumatic solenoid to drive the jetting action
. With Asymtek's new DispenseJet DJ-9000, jetting is faster and simpler than ever. Based on the award-winning DJ-2100 series, the DJ-9000 has a high shot-generation rate, can be cleaned in a few minutes, and has fast changeover of wetted parts