SMTnet Express, June 20, 2019, Subscribers: 32,068, Companies: 10,815, Users: 24,854 Dissolution in Service of the Copper Substrate of Solder Joints Credits: Nihon Superior Co., Ltd. It is well known that during service the layer of Cu6Sn5
Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints. Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints. The purpose
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) of SC48B Working Group 5 responsible for electrical and electronic connector testing standards. He has authored papers on connector reliability topics presented at IEEE Holm and American Society for Quality conferences, along with the International Conference on Electrical Connectors, and others. He is an
