4 what are the cause for solder printing machine cycle tim higher results

Technical Library: what are the cause for solder printing machine cycle tim higher (4)

Best Practices for Improving the PCB Supply Chain: Performing the Process Audit

Technical Library | 2018-08-03 14:37:59.0

In the electronics industry, the quality and reliability of any product is highly dependent upon the capabilities of the manufacturing suppliers. Manufacturing defects are one of the top reasons why companies fail to meet warranty expectations. These problems can result in severe financial pain and eventual loss of market share. What a surprising number of engineers and managers fail to realize is that focusing on processes addresses only part of the issue. Supplier selection also plays a critical role in the success or failure of the final product.

DfR Solutions

Method for the Manufacture of an Aluminum Substrate PCB and its Advantages

Technical Library | 2015-09-17 17:36:56.0

RoHS legislated restrictions on the materials used in electronics manufacture have imparted significant challenges on the electronics industry since their introduction in 2006. The greatest impacts have been felt by the mandated elimination of lead from electronic solder followed by the demand for the elimination of haloids from flame retardants used in traditional PCB laminates. In the years which have followed the electronics industry has been beset with a host of new challenges in its effort to comply. Failure mechanisms, both new and old, have surfaced which demand solution and the industry suppliers and manufacturing technologists have worked diligently to remedy those vexing faults through the development of a wide range of new materials and equipment for both board manufacture and assembly, along with modifications to the processes used in the manufacture and assembly of printed circuit boards.

Verdant Electronics

Express Newsletter: what are the cause for solder printing machine cycle tim higher (1005)

SMTnet Express - January 5, 2014

SMTnet Express, January 5, 2014, Subscribers: 23,708, Members: Companies: 14,158 , Users: 37,476 The Last Will And Testament of the BGA Void Dave Hillman, Dave Adams, Tim Pearson, Brad Williams, Brittany Petrick, Ross Wilcoxon - Rockwell Collins

Partner Websites: what are the cause for solder printing machine cycle tim higher (107)

Solder Paste Dispensing - ITW EAE

| https://www.itweae.com/applications/dispensing/solder-paste

 incorporate the most advanced deposition technology for solder paste dispensing, traditionally one of the most difficult materials to dispense consistently

The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf

. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys

Heller Industries Inc.

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The Branford Group
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