PCB Libraries, Inc. | https://www.pcblibraries.com/forum/standard-chip-component-dimensions_topic1729.html
. The Height is the main driver of this component lead form. Issue: if you use a 0603 land pattern considering the highest package, you may be dumping too much solder on an 0603 that is 50
| https://www.smtfactory.com/What-is-the-parameter-debugging-skills-of-the-Full-auto-SMT-Stencil-Printer-id3338478.html
. If the shape of the solder paste is not printed on the PCB pad, the printing speed can be appropriately reduced. The smaller the minimum component pin spacing on the printed circuit board, the greater the viscosity of the solder paste, and the printing speed needs to be reduced accordingly, and vice versa
