Technical Library | 2022-01-28 02:19:23.0
This white paper provides an overview of the design and development process for the various hardware components that make up the 5G ORU white box. Whizz Systems is responsible for the electrical, thermal, mechanical engineering, and manufacturing aspects, as well as system validation and bring up of the turn key white box ORU solution.
Technical Library | 2019-06-19 11:06:46.0
Tin (Sn) metal displays the characteristic of growing “tin whiskers” from pure tin coatings (most actively on relatively thin, electrodeposited or immersion tin coatings), usually months or years from the initial deposition of the tin. Tin whiskers are electrically conductive, filamentary, single crystals of white (beta phase) tin. These filaments of single crystal tin are usually one to five microns in diameter, and a few microns up to several tens of millimeters long, that grow spontaneously from the tin coatings. Alloying additions of several percent (by weight) of lead (Pb) prevents these electrically conductive tin whiskers from growing. Pb alloyed into the Sn was discovered to prevent the occurrence of tin whiskers in electronic assemblies in the 1950s as the Bell Laboratories solution to the problem of tin whiskers. The alloying of the tin with lead has thus quietly averted incalculable losses from short circuits in electronic equipment for the last 60 years.
Technical Library | 2020-03-09 10:50:17.0
A customer called the Helpline seeking advice for cleaning no-clean fluxes prior to applying a conformal coating. The customer's assemblies were manufactured with a no-clean rosin based solder paste (ROL0) and were cleaned with an isopropyl alcohol (IPA) wash. After cleaning, a white residue was sometimes found in areas with high paste concentrations and was interfering with the adhesion of the conformal coating (Figure 1). For conformal coatings to adhere properly, the printed circuit board (PCB) surface must be clean of fluxes and other residues. In addition, ionic contamination left by flux residues can lead to corrosion and dendrite growth, two common causes of electronic opens and shorts. Other residues can lead to unwanted impedance and physical interference with moving parts.
Technical Library | 2007-01-31 14:10:17.0
This white paper is suitable for both new and experienced users. It is a practical education in the use and misuse of auger valves for solder paste dispensing.
Technical Library | 2011-03-16 20:09:11.0
The backplane is the key component in any system architecture. The sooner one considers the backplane’s physical architecture near the beginning of a project, the more successful the project will be. This white paper introduces the concept of a backplane
Technical Library | 2019-06-03 21:07:34.0
The objective of this White Paper is to provide users of the above products in the electronics industry a clear understanding of the different types of stencil cleaning paper/fabrics that are currently available. Fine pitch applications are more the norm now and so the performance of stencil cleaning rolls is more critical than ever before. This White Paper will give solder paste stencil printing engineers and purchasing professionals an insight into the main products on the market, thereby enabling them to make informed decisions.
Technical Library | 1999-05-07 10:47:00.0
White residue remaining after cleaning circuit board assemblies can be caused by a variety of chemicals and reactions. Rosin and water-soluble fluxes, circuit board resins and epoxies, component materials and other contamination all contribute to this complex chemistry. This paper discusses many of the sources of the residues that seem to be an ever-increasing occurrence.
Technical Library | 2023-12-26 17:50:54.0
In this white paper, we discuss the pros and cons of five analytical techniques when applied to residue analysis on electronic assemblies. We evaluate the following for their application and limitations for analyzing both visible and invisible residues: FITR, SEM/EDX, XRF, Ion Chromatography, and ROSE
Technical Library | 2016-09-19 20:26:36.0
This white paper seeks to set out the value of a ‘smarter’ approach to the reflow process and how a more intelligent oven can offer real added value and performance to the entire line. It also lays out some of the criteria that is important when selecting smart equipment for a smart process, that conforms to, and is ready for, IoM or Industry 4.0
Technical Library | 2022-10-13 13:02:11.0
Effective and reliable dispensing is based primarily on process technology that has been perfectly set up for the specific project. Anyone tasked with planning dispensing systems and responsible for the processes should know the principles and key factors involved so that the dispensing processes can be successfully implemented in cooperation with system and material partners. This White Paper explains the relevant aspects of process technology and provides valuable practical tips.
