Technical Library | 2023-09-23 22:31:52.0
Dry boxes can be implemented at various points within the Mfg. environment; for med-long term inventory, or for short term handling on the production floor, and in some cases (with certain conditions) as a process replacement for baking. Bare boards, raw components and partially assembled PCB's can benefit from ultra-low humidity storage.
Technical Library | 2019-05-23 10:42:00.0
Why identify flux residues? The primary purpose of flux is to reduce species of metal oxides from solderable surfaces, and to act as a mechanism for lifting and removing debris. If the assembly is not properly cleaned after manufacturing, flux may continue to reduce metals and may eventually corrode the assembly. When the assembly is powered, the metal ions may precipitate along electromagnetic field lines and form dendritic shorts. In addition, the presence of residue can alter the insulation properties of a board, affect the adhesion of the conformal coating, or interfere with the moving parts of the assembly. In radio frequency (RF) applications, flux may change the RF properties on the surface of the printed circuit board (PCB) such as the dielectric strength, surface resistance, and Q-resonance.
Technical Library | 2018-09-21 10:12:53.0
Moisture accumulates during storage and industry practice recommends specific levels of baking to avoid delamination. This paper will discuss the use of capacitance measurements to follow the absorption and desorption behaviour of moisture. The PCB design used in this work, focused on the issue of baking out moisture trapped between copper planes. The PCB was designed with different densities of plated through holes and drilled holes in external copper planes, with capacitance sensors located on the inner layers. For trapped volumes between copper planes, the distance between holes proved to be critical in affecting the desorption rate. For fully saturated PCBs, the desorption time at elevated temperatures was observed to be in the order of hundreds of hours. Finite difference diffusion modelling was carried out for moisture desorption behaviour for plated through holes and drilled holes in copper planes. A meshed copper plane was also modelled evaluating its effectiveness for assisting moisture removal and decreasing bake times. Results also showed, that in certain circumstances, regions of the PCB under copper planes initially increase in moisture during baking.
Technical Library | 2017-08-12 16:04:30.0
PCB Assembly is Collaborative Manufacturing
Technical Library | 2013-08-13 09:49:53.0
One of the common issues I’ve noticed when visiting shops that use crimp force monitors (CFMs) is that the CFMs are usually turned off, regardless of the brand, because engineers and operators are not using them properly. Why, with all of their benefits, are CFMs not being used regularly by employees? One of the biggest problems is the lack of understanding of the variables affecting the CFM’s ability to detect variations. Crimp quality detection is similar to baking a cake. There are a lot of ingredients and if one ingredient is missing or of bad quality, you likely are not going to achieve your desired result. This article will go back through the basics of a crimp quality detection system and discuss what ingredients or variables you need to consider before switching off that CFM.
Technical Library | 2017-11-14 15:30:04.0
Can you put a product that hasn't been fully tested on the market? When it comes to Printed Circuit Board (PCB) assembly and manufacturing, most firms’ answer is neither a strict yes or no.
Technical Library | 2017-08-25 14:48:39.0
High Quality Solutions to Reduce Manufacturing Costs and Time
Technical Library | 2023-11-14 19:42:24.0
Selective soldering is not a new process. It is already exists and used 30 years ago for through-hole component by different industries for automotive and medical products. Now most manufacturing industries are moving forward on SMD's miniaturization to reduce PCB complexity and balance component density on the board to ensure a good assembling process. By this concept, why selective soldering still utilized and used? Does it because of component reliability, uniqueness or complexity having this in mind next question will be which platform will best fit for the product
Technical Library | 2018-08-03 14:37:59.0
In the electronics industry, the quality and reliability of any product is highly dependent upon the capabilities of the manufacturing suppliers. Manufacturing defects are one of the top reasons why companies fail to meet warranty expectations. These problems can result in severe financial pain and eventual loss of market share. What a surprising number of engineers and managers fail to realize is that focusing on processes addresses only part of the issue. Supplier selection also plays a critical role in the success or failure of the final product.
Technical Library | 2014-02-13 16:46:23.0
The high speed transmission applications in the electronic product become inevitable developing trend. The signal integrity becomes the most important issue in the electronics industry. The material suppliers, PCB manufacturers, OEM designers commonly face the serious issue "how to keep signal integrity operated in the high speed transmission" for the modern electronic application nowadays
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