Industry News | 2019-09-30 08:53:43.0
10.01.2019 – Atlanta – During a two-day technical workshop in New England, Koh Young America will discuss the important role of solder paste inspection (SPI) to understand and then optimize the solder paste print process to improve printed circuit board assembly production yield. Additionally, Panasonic will discuss how the proven connectivity between its printers and mounters and the Koh Young SPI and Automated Optical Inspection (AOI) equipment will benefit manufacturers with Advanced Process Control (APC). The 2-day Print Process Characterization workshop is scheduled for 23-24 October 2019 at the Westford Regency with live machine demonstrations at the Assembly Products Lab in Chelmsford, MA.
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