Industry Directory | Manufacturer
A manufacturer of desoldering braid (wick) with an emphasis on continuing advancement in soldering/desoldering technology, visual and x-ray inspection systems, fume extraction, and solder paste inspection systems.
Industry Directory | Consultant / Service Provider
Elmet LLC is an accredited lab, primarily providing cross sectioning of circuit boards, visual and x-ray inspections of PCBAs and other metallographic and metallurgical services including SEM examination and EDS analysis.
SMT peripheral equipment mainly refers to: printing press, docking station, Mounter, reflow soldering, AOI, wave soldering and other equipment. SMT peripheral technology is similar to the original hyper threading technology. Users who have experienc
SMT peripheral equipment mainly refers to: printing press, docking station, Mounter, reflow soldering, AOI, wave soldering and other equipment. SMT peripheral technology is similar to the original hyper threading technology. Users who have experienc
Electronics Forum | Wed Jan 05 09:24:53 EST 2005 | cyber_wolf
Well...here is what I can tell you: I have over $40K worth of bent A12,A13,A14 tools.Yes you heard me right $40K worth. (Since 1995) Mydata used to make a repair kit to fix them but decided to quit. They tell me the reason they quit making the kit i
Electronics Forum | Wed Jan 05 10:55:12 EST 2005 | OverTheHill
WOW Sr.Tech, 40K worth of bent tools? I'm about ready to be sh*t canned because of 1K's worth. As for trimming the mags, the product is running fine (many boards) and then out of nowhere the tool bends, so I assume my PERFECT operators trimmed the ma
Used SMT Equipment | Soldering - Reflow
Edge Rail No Mesh Belt Notes: The system does not have a controller. CPU damage Fan speed controller damage Motor conveyor damage Serial: X2N120009 Features: Dimensions: 239" x 57" x 70"
Used SMT Equipment | Pick and Place/Feeders
OS: Windows XP Cycle Count: CTR1 45245085 CTR2 2848934 Includes Parts Tray Feeder Notes: The system will not power up. PTF motor elevator damage Main Unit damage Power supply 5V,12V Damages Serial: 10143531 Fea
Industry News | 2015-05-07 19:28:29.0
MIRTEC announce a new strategic cooperation that will empower yield improvement in the electronics manufacturing industry.
Industry News | 2003-03-25 09:15:19.0
The Dragon was demonstrated at the CPCA show in Shanghai last week
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Parts & Supplies | Pick and Place/Feeders
JUKI IP-X3 BOARD ASSY 40001920-40052359 1.Quality and package:Each part is checked and tested strictly by our professional QC, make sure each product is in good quality and working condition. Meanwhile each package would be well packed and protecte
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Parts & Supplies | Pick and Place/Feeders
FUJI H01 Head without back up pin .AA15X26 1.Quality and package:Each part is checked and tested strictly by our professional QC, make sure each product is in good quality and working condition. Meanwhile each package would be well packed and prote
Technical Library | 2020-11-09 16:59:53.0
A customer contacted ACI Technologies regarding a high failure rate of their assemblies. They provided assemblies to be X-rayed and inspected for the purpose of identifying any process related issues such as (but not limited to) solder and assembly workmanship and evidence of damage due to moisture related problems during reflow (a.k.a. "popcorning"). Moisture damage usually appears as physical damage to the component. The first indication of moisture damage would be externally observable changes to the package in the form of bulging or fractures to the outer surface of the component, an example of which is shown in Figure 1. Internally observable indicators of moisture damage typically include fractures to the die inside the package and lifted or fractured wire bonds. These conditions would be apparent during transmissive X-ray inspection. Another symptom of moisture related damage would be inconsistent solder joint sizes that result from package deformation during the liquidus phase of the reflow process. None of these indicators of moisture related damage were present on the customer samples.
Technical Library | 2019-09-23 09:35:00.0
Failure analysis (FA), by its very nature, is needed only when things goawry. Before any testing is performed on the sample, a decision mustbe made as to whether or not the sample is allowed to be destroyedin the process of testing. Non-destructive testing can allow for re-use of the assembly since the functionality is not altered, but there still remains the possibility that inadvertent damage can occur through the course of the analysis. If non-destructive testing is preferred, then the following types of analysis can be performed. The testing can be divided into four categories: visual, X-ray (X-ray imaging and X-ray fluorescence), cleanliness (resistivity of solvent extract, ion chromatography, and Fourier transform infrared spectroscopy), and mechanical (non-destructive wire bond pull).
· What is the difference between SMT vacuum reflow soldering machine and ordinary reflow soldering machine? · What problems can be solved by smt vacuum reflow soldering machine? · What is the basic principle of vacuum reflow machine? · Ho
http://www.pcb-separator.com/ Nutzentrennmaschine/Nutzentrenner/PCB depaneling machine ASCEN-620 NSL zum Trennen von Aluminium Leiterplatten/FR4
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Career Center | Madison, Alabama USA | Engineering,Production
Performs electronic assembly functions on an as needed basis. Performs rework/replacement/placement operations on BGAs using various rework systems without doing damage to the assemblies. Performs X-ray inspection of BGAs using CRX-2000 real time
SMTnet Express, March 31, 2016, Subscribers: 24,152, Companies: 14,760, Users: 39,935 EMI-Caused EOS Sources in Automated Equipment Vladimir Kraz; OnFILTER, Inc. Electrical overstress causes damage to sensitive components, including latent damage
SMTnet Express, July 10, 2014, Subscribers: 22902, Members: Companies: 13928, Users: 36450 Fatigue Damage Behavior of a Surface-mount Electronic Package Under Different Cyclic Applied Loads. Ren Huai-Hui, Wang Xi-Shu - Wind Power Engineer
Imagineering, Inc. | https://www.pcbnet.com/blog/when-to-use-x-ray-inspection-in-pcbs/
. X-ray images provide a clear view of tightly placed components without risking unnecessary damage. Small PCBs – PCBs are used in devices of all shapes and sizes, and some boards need to be extremely small to fit inside certain appliances
| https://www.wesource.com/dek/dek-ekra-x-series-squeegee-assemblies-12-300mm-set-of-2-id-000480-7/22/
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