Industry Directory | Consultant / Service Provider / Distributor / Manufacturer
SMT XTRA is a global electronics specialist, providing productivity enhancing solutions for the global Surface Mount electronic assembly sector.
Industry Directory | Manufacturer
Flason is high-tech enterprise focusing on SMT research and development,building new advanced solutions in SMT Assembly machines, like reflow oven, wave soldering machine, pick and place machine, AOI,SPI,PCB conveyor etc.
Technical parameter: Model 1200 Printing area 1250×320mm Fixed printing position PCB Outer Or Pin Positioning Table trimming Front/Back±
ProntoAOI is used by electronic manufacturers to quickly program their Automatic Optical Inspection (AOI) machines and X-RAY Equipment. ProntoAOI programs most popular AOI Equipment such as YESTech, Mirtec, Orbotech, Agilent, Omron, CyberOptics, Vi
Electronics Forum | Wed Feb 25 14:59:48 EST 2009 | vetteboy86
I have done a search related to x ray machines and found good data on why and when to buy. What I would like now is education on where and what to buy. Before we purchase, we plan on sending boards out to have this task performed, but when I talk to
Electronics Forum | Wed Feb 25 17:04:06 EST 2009 | davef
Here's a good starting point: http://www.smtinfo.net/Db/_X-ray%20Inspection.html
Used SMT Equipment | X-Ray Inspection
X-Ray Inspection System Approx Dimensions: 55" x 42" x 56" Location: San Marcos, CA USA Note: This machine was refurbished by the OEM in 2009. Features: 70KV X-Ray Source 4-40X Zoom Lens Camera Dual View Video RTVA Video Frame Averager
Used SMT Equipment | X-Ray Inspection
This machine is included in our December 6 - 9 online auction. Please visit the below website for all of the details on this machine. https://bajabid.hibid.com/lot/106777075/2012-nordson-dage-xd7500nt-x-ray-inspection
Industry News | 2003-02-06 08:28:24.0
Will Premiere Its 2002 Roadmap at IPC SMEMA Council�s APEX Conference in Anaheim, CA, March 31-April 2
Industry News | 2003-03-11 08:16:17.0
Lightspeed has already shipped its first product, and has set up production in a new building with up to date facilities and equipment.
Parts & Supplies | Pick and Place/Feeders
YAMAHA YV SERIES 710 x 395 x 200mm SMT TRAY Exterior Dimension: 710 x 395 x 200mm Machine model compatible: YAMAHA YV Series
Parts & Supplies | Assembly Accessories
YAMAHA 340 x 395 x 20mm YV SERIES TRAY Exterior Dimension: 340 x 395 x 20mm Machine model compatible-- YAMAHA YV
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Simplify Dispensing with GPD Global’s Island Series Dispense Platforms Island Series robots give you versatility to do simple, repetitive automation jobs. Work areas range from 300 mm x 400 mm to 400 mm x 400 mm. All Island Series robots are compati
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Events Calendar | Mon Nov 25 00:00:00 EST 2019 - Mon Nov 25 00:00:00 EST 2019 | ,
Webinar: Overcoming Challenging X-Ray Problems
Events Calendar | Thu Feb 15 00:00:00 EST 2024 - Thu Feb 15 00:00:00 EST 2024 | Dayton, Ohio USA
Ohio Valley In-Person Technical Meeting: Extracting Value from SPI, AOI and X-Ray Technologies
Career Center | Madison, Alabama USA | Engineering,Production
Performs electronic assembly functions on an as needed basis. Performs rework/replacement/placement operations on BGAs using various rework systems without doing damage to the assemblies. Performs X-ray inspection of BGAs using CRX-2000 real time
Career Center | , Alabama Saudi Arabia | Engineering,Production,Research and Development
SNR MANUFACTURING ENGINEER WANTED Design Change Management and New product Introduction. Solder paste printing process (knowledge of Fuji screen printer machines. Stencil design/ modification and the use of Gerber data. SMT placement machines (Kno
Career Center | garaden grove, California USA | Engineering,Management,Production,Quality Control,Technical Support
11 years experience in SMT process.
Career Center | Cabuyao,, Laguna Philippines | Engineering,Maintenance,Production,Technical Support
�X 10 years experience in SMT field of manufacturing company,knowledge in GC-Powerplace software. �X Knowledge in programming and operating Modular/Turret Machine in Surface Mount Technology and Flipchip technology. �X Expertise in the field of SMT m
Featured Article Return to Front Page Industrial X-Ra
| https://www.smtfactory.com/I-C-T-High-end-AOI-Machine-and-X-Ray-Chip-Counter-id47378747.html
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/x-ray
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