Industry Directory | Manufacturer
ITS (www.itechserv.com) provides a full range of electronics manufacturing, test, logistics and repair services. Fine pitch SMT, ICT, HASS, box build, BGA repair, X-Ray and is ISO9001. Real time lot tracibility and serial data collection system RTM 3
Gary Ellenbogen, D.D.S. is a general and cosmetic dentist who has been providing excellent dental services to patients throughout the Fairfax County, Virginia area for over 34 years.
New Equipment | Assembly Services
Printed Circuit Board Assemblies Valuetronics has experience in many methods of printed circuit board assembly from through hole and mixed technology to customized fine pitched surface mount technologies. Our process capabilities include: 01005
New Equipment | Rework & Repair Services
BEST offers contract PCB rework services. If you get in bind and need resources to perform difficult repairs or if the volume of work ahead of you is too extreme to get through in the deadline at hand then consider BEST PCB rework services. If you th
Electronics Forum | Thu Jul 30 08:46:12 EDT 2015 | hemantp
We are having X-Ray Machine X TEK HMXST-160 The machine is working fine with respect to Interlocking , X-ray on , but not able to zoom and move the Joystick positions ,it is stand only in one position while starting the application we are getting
Electronics Forum | Wed Jan 05 11:43:11 EST 2000 | Dave F
Yins, In low volume applications, using X-ray for BGA mounting process control is: 1 Very expensive approach, as you've stated. 2 Requires beaucoup operator training and interpretation of results. Which is double bad, because of the intermittent n
Industry News | 2008-08-14 14:03:27.0
San Jose, CA � This year's fifth annual International Wafer-Level Packaging Conference (IWLPC), October 13-16, will be the largest ever, according to Dr. Ken Gilleo, IWLPC general chair.
Industry News | 2018-04-11 20:04:01.0
SMTA Europe announces Session 3 Technical Program on Advanced Test Methods at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
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Parts & Supplies | Pick and Place/Feeders
JUKI AF, AN electric feeder: AF24FS E5005706AB0, AF24FS-OP E5007706AB0 AF05HP E1001706AB0, AF081E E1002706AB0 AF081P E1004706AB0, AN081C E1009706AB0 AF16FS E4003706AB0, AF16NS E4004706AB0 AQ02HP 40042271, AF12FS E3003706AB0 JUKI FF electric fee
Parts & Supplies | Assembly Accessories
AXPC Power Supply AC/DC 9498 396 03997 Power supply WPS-10-12L Power supply LPS-200-24T Power supply WPS-15-12L Power supply WPS-120-12L Power supply PS-25-24T Power supply LPS-300-24T Power sup
Technical Library | 2019-05-24 09:27:33.0
Decapsulation, or de-cap, is a failure analysis technique which involves the removal of material packaging from an integrated circuit (IC). After de-cap, visual inspection by optical microscopy of the internal circuitry may reveal areas where damage is most likely to have occurred. In addition, scanning electron microscopy (SEM) with energy dispersive x-ray spectroscopy (EDS) can identify the composition of any anomalies present after de-cap under higher magnification. The removal process of package material can be done either mechanically or chemically depending on the design of the integrated circuit. With ceramic packaging, de-cap is usually done mechanically by chiseling off the top with a fine razor and small hammer. For plastic packaging, de-cap requires chemical etching by strong acids. In this Tech Tips article, de-cap by chemical etching will be outlined step by step.
Technical Library | 2019-05-29 10:38:59.0
Decapsulation, or de-cap, is a failure analysis technique which involves the removal of material packaging from an integrated circuit (IC). After de-cap, visual inspection by optical microscopy of the internal circuitry may reveal areas where damage is most likely to have occurred. In addition, scanning electron microscopy (SEM) with energy dispersive x-ray spectroscopy (EDS) can identify the composition of any anomalies present after de-cap under higher magnification. The removal process of package material can be done either mechanically or chemically depending on the design of the integrated circuit. With ceramic packaging, de-cap is usually done mechanically by chiseling off the top with a fine razor and small hammer. For plastic packaging, de-cap requires chemical etching by strong acids. In this Tech Tips article, de-cap by chemical etching will be outlined step by step.
This video presents the capabilities of BEST Inc in terms of its ability to perform high end PCB rework and repair services. BEST Inc., located in Rolling Meadows IL is a company of soldering "geeks". We rework/repair PCBs, train and certify solderin
Shenzhen zhuomao is located in Shenzhen, China.SHENZHEN ZHUOMAO TECHNOLOGY CO.,LTD - Seamark Group The leading manufacturer of BGA/SMT rework, X-ray inspection system, TV LCD panel laser repair for 13 years in China. Established in 2005, we have coo
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Tue Dec 08 00:00:00 EST 2020 - Tue Dec 08 00:00:00 EST 2020 | Online,
SMTA California Technology Day
Events Calendar | Wed Jun 20 00:00:00 EDT 2018 - Wed Jun 20 00:00:00 EDT 2018 | ,
Everything You Need to Know About X-Rays
Career Center | Oakville, Ontario Canada | Engineering,Production,Quality Control
Technicians / Technologists To help us continue setting the pace in a rapidly changing manufacturing environment, we need people to operate state of the art manufacturing equipment, perform failure analysis and quality inspection on a wide variety
Career Center | Oakville, Ontario Canada | Production
Technicians / Technologists To help us continue setting the pace in a rapidly changing manufacturing environment, we need people to operate state of the art manufacturing equipment, perform failure analysis and quality inspection on a wide variety o
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
Career Center | Fort Worth, Texas USA | Engineering,Maintenance,Production,Quality Control,Research and Development
A mechanically-inclined, results-oriented, lean-driven professional with proven success in implementing programs that result in efficiencies and cost savings. Effectively communicates with diverse audiences, encourages training and employee developme
Modern 2D / 3D X-Ray Inspection - Emphasis on BGA, QFN, 3D Packages, and Counterfeit Components Modern 2D / 3D X-Ray Inspection - Emphasis on BGA, QFN, 3D Packages, and Counterfeit Components With PCB complexity and density increasing and also
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