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MIRTEC to Offer Live Remote Demo of the GENESYS-PIN 3D Pin Inspection System at SMTconnect

Industry News | 2022-04-13 10:22:58.0

MIRTEC will premier its line of 3D AOI and SPI Inspection Systems Hall 4A, Stand 128 at SMTconnect, scheduled to take place May 10-12, 2022 in Nuremberg.

MIRTEC Corp

MIRTEC to Display Award-Winning 3D AOI and SPI Solutions at APEX 2022

Industry News | 2021-12-21 14:45:26.0

MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1122 at the 2022 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place January 25-27, 2022, at the San Diego Convention Center.

MIRTEC Corp

MIRTEC to Display Award-Winning 3D AOI and SPI Solutions at APEX 2023

Industry News | 2022-12-14 12:21:04.0

MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1841 at the 2023 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Jan. 24-26, 2023, at the San Diego Convention Center in California.

MIRTEC Corp

MIRTEC GmbH to Have a Strong Presence at SMTConnect 2023 with 5 Inspection Systems on Display

Industry News | 2023-04-11 09:52:04.0

MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems at SMTconnect, scheduled to take place May 9-11, 2023 in Nuremberg, Germany. The company will showcase a total of five (5) Inspection Systems specifically designed to address the full spectrum of inspection requirements associated with the electronics manufacturing industry in Hall 4A, Stand 128.

MIRTEC Corp

MIRTEC to Display Award-Winning 3D AOI and SPI Solutions at the SMTA Guadalajara Expo 2023

Industry News | 2023-09-25 14:05:43.0

MIRTEC is pleased to announce its participation in the upcoming SMTA Guadalajara Expo on Wednesday, Oct. 25, 2023. The event is scheduled to take place at Expo Guadalajara in Jalisco, Mexico. In Booth 319, MIRTEC will feature a total of four (4) Inspection Systems specifically designed to address the full spectrum of inspection requirements associated with the Electronics Manufacturing Industry:

MIRTEC Corp

MIRTEC to Exhibit its Complete Line of AI-Based SMT and Automotive Pin Inspection Solutions at Productronica 2021

Industry News | 2021-10-11 16:13:11.0

MIRTEC will showcase its cutting-edge INTELLI-PRO AI Based Smart Factory Automation Solution and GENSYS-PIN Automotive Pin Inspection System in booth #461, Hall A2 at the 2021 Productronica exhibition. The world's largest exhibition for the electronic manufacturing industry will take place on Nov. 16-19, 2021, at Messe Munich exhibition hall in Germany.

MIRTEC Corp

Example of how to import CAD data and BOM files, and export setup files for ATE, flying probe ATE and design 'bed of nails' fixturing.

Example of how to import CAD data and BOM files, and export setup files for ATE, flying probe ATE and design 'bed of nails' fixturing.

Videos

www.unisoft-cim.com/pcbtest.htm - In minutes the Unisoft ProntoTEST-FIXTURE software translates CAD & BOM files into real reference designators, netlists, X/Y component pin geometries, values, tolerances, part numbers, etc. This data is used by Test

UNISOFT Corporation

I.C.T | AOI Optical Inspection Machine For SMT Components and DIP Solder Joint

I.C.T | AOI Optical Inspection Machine For SMT Components and DIP Solder Joint

Videos

I.C.T Provide SMT Production Line solutions with Automated Optical Inspection (AOI) AOI is short for Automated Optical Inspection, which is widely used in the electronics industry to check the appearance of PCBA assembly at the back end of the cir

Dongguan Intercontinental Technology Co., Ltd.

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

IPC Conference to “Clean Up” Reliability Problems

Industry News | 2013-10-28 16:31:54.0

IPC Conference on Solder and Reliability: Materials, Processes and Tests, November 13–14 in Costa Mesa, Calif.

Association Connecting Electronics Industries (IPC)

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