| https://www.eptac.com/faqs/ask-helena-leo/ask/failing-to-remove-gold-plating-in-final-assembly
Failing to Remove Gold Plating in Final Assembly - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/
. A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly. Note: Gold embrittled solder connections can occur regardless of gold thickness when solder volume is low or the soldering process dwell time is not sufficient to allow the gold to dissolve throughout the
| https://www.eptac.com/ask/failing-to-remove-gold-plating-in-final-assembly/
Failing to Remove Gold Plating in Final Assembly - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/blog/kris
managing solder training. She talks about her individual role, team dynamics, achievements, and challenges, notably the shift to online classes and the hurdles presented by the pandemic
| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-wire-bond-failing-pull-test
: I’m not quite sure how to answer this question as it does not state how the joint failed. Did the wire pull off the gold plating
| https://www.eptac.com/ask/gold-wire-bond-failing-pull-test/
: I’m not quite sure how to answer this question as it does not state how the joint failed. Did the wire pull off the gold plating
| https://www.eptac.com/soldertips/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering/
2.54 micrometers or 100 micro-inches (.00001”) and from all components which will be hand soldered, regardless of gold thickness. The double tinning process is for tinning the components prior to soldering them, and the need is to dip those components in the solder pot twice to remove the gold plating
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
. Some typical brazing alloys include copper-zinc, copper-gold, copper-phosphorous, and silver-based alloys. The melting temperatures for brazing alloys range from 450° C (852° F) to 1100° C (2012° F
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms
. Some typical brazing alloys include copper-zinc, copper-gold, copper-phosphorous, and silver-based alloys. The melting temperatures for brazing alloys range from 450° C (852° F) to 1100° C (2012° F
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5255
) when the solder gold content exceeds 5% by weight. Controlling the component gold plating thickness as well as the soldering process temperature and time can prevent gold embrittlement
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