Electronics Forum: part (Page 1007 of 1123)

Re: Sutable ICT

Electronics Forum | Thu Jul 15 21:41:28 EDT 1999 | Scott McKee

| We have a new facility for producing M/B, RAM modules...etc | what kind of ICT Machines do you recommend provided that. | We have Philips (Topaz & Emerald) for Pick &Place. | Also identify what kind of testing do you recommend during the process |

Re: uBGA

Electronics Forum | Mon Jul 12 14:30:37 EDT 1999 | Earl Moon

| Hi all , | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | 1. Is underfill required for micro-BGAs? | | 2. What type of stencil apertures are the industry standards for uB

Re: uBGA

Electronics Forum | Tue Jul 13 13:28:18 EDT 1999 | Upinder Singh

| | Hi all , | | | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | | | 1. Is underfill required for micro-BGAs? | | | | 2. What type of stencil apertures are the industry st

Re: BGA collapse during reflow

Electronics Forum | Mon Jul 12 12:39:39 EDT 1999 | M Cox

| I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-laye

Re: BGA collapse during reflow

Electronics Forum | Wed Jul 14 14:05:52 EDT 1999 | KT

| I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-laye

Re: Reflow Oven Capability Study

Electronics Forum | Wed Jul 07 22:59:06 EDT 1999 | Dave F

| Hi! | I'm a process engineer attempting to do a capability study on our existing convection reflow oven - Heller 1500. It was recommended by an independent consultant to do at the very least, load testing, process ready testing, and board uniformi

Re: VOC free flux wave solder fixtures

Electronics Forum | Tue Jul 06 14:23:27 EDT 1999 | Earl Moon

| | | I've heard that use of VOC free flux with wavesolder fixtures can be challenging due to entrapment of water in the fixture. | | | | | | Is anyone out there successfully running VOC free with wave fixtures & did you experience problems? If so,

Re: product changeovers

Electronics Forum | Fri Jul 02 07:55:52 EDT 1999 | Earl Moon

50% reduction in time. One draw back, the availability of feeders... You need 280 feeders max to change over a max capacity of 140 feeder machine (or a variance of a product mix vs. part numbers); then there's 8mm, 12mm, 16mm, sticks feeders that c

Re: Off Pad Printing

Electronics Forum | Mon Jun 28 17:03:59 EDT 1999 | M Cox

| Hey there gang, how's it going ? | | Anyway's here's my probelm, got a new product to build double sided reflow, lot's of so20's and PLcc's 1206's, 0805's the usual stuff. Probelm is all the pad spacing of the 1206's are too big, my component's ar

Re: Off Pad Printing - an update

Electronics Forum | Wed Jun 30 15:24:23 EDT 1999 | Earl Moon

| | | | | | | | | | | | | | snip | | | | | | | | | | | | | | | John and Dave, | | | | | | | | | | | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable res


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