Electronics Forum: current (Page 102 of 378)

Protection of the component in the double Wave

Electronics Forum | Thu Jun 20 03:29:56 EDT 2002 | Josef

I would like to ask you for help. We use mixed technology and we need to protect SMT components in double Wave. Currently we use the carrier for protection of this component. In this case this procces is not possible to use it due to gap between SMT

Soldering BGA

Electronics Forum | Wed Jun 26 01:08:09 EDT 2002 | ianchan

Hi Dave F, I'd hold you to that "could" opinion of yours... and I'd be most willing to give the new VP ovens a try if such ovens become commerically acceptable to the pocket and match up to our current process control requirements (that we can achie

Reflow PBGA

Electronics Forum | Wed Jun 26 11:44:06 EDT 2002 | jseagle

Steve, We do not currently run BGAs, but I have been told by a CM we use that does BGAs, that our Heller 1500 (5 zone) oven has an insufficient number of zones to properly reflow a BGA. Anyone else have an opinion about this it would be appreciated

Trace Elements in Solder

Electronics Forum | Wed Jun 26 12:21:30 EDT 2002 | dason_c

You can check with Alpha. ie Alpha had 3 different grade of the 63/37 bar, Vaculoy, Vaculoy SMG and HiFlo. You can consult with them and see which one fit for your current supplier. http://www.alphametals.com/products/solder_barwire/index.html Go

Capacitor

Electronics Forum | Thu Jun 27 08:48:08 EDT 2002 | yngwie

I was approached by the comp. suplier to change the capacitors that I currently used. No change in elect. charateristic, but only on : a) change of palladium to nickel base inner electrode b) outer electrode material i.e. from silver to copper. Que

solder crack

Electronics Forum | Sun Jun 30 20:00:56 EDT 2002 | redmary

the SOIC encounter solder crack after reliability test, the common process is: SMT---manual soldering---IPT(in process test)---potting---T/C(thermal cycling,only add current and voltage)---B/T and F/T (burn in and functional test). the condition is 2

Applying Thicker LPI Soldermask

Electronics Forum | Mon Jul 01 16:15:02 EDT 2002 | Matt Kehoe

We are currently trying to gather information pertaining to applying LPI soldermask thicker than normal. The thick coating is necessary for the SIPAD ssd process however, because of the numerous brands of mask and application methods there is no sing

SI units conversion Calculator

Electronics Forum | Wed Jul 03 19:17:54 EDT 2002 | davef

I prefer 'YAUC' [Yet Another Unit Converter] by Marius Miller. YAUC converts between many units - Metric, Imperial and others. It supports 585 units, in 40 categories, including Acceleration, Angle, Area, Current, Density, Energy, Force, Frequency

J-Std-001C Class 3 Soldering with WS fluxes

Electronics Forum | Tue Jul 23 15:41:31 EDT 2002 | habs24

Does anyone have any information or experience soldering of class 3 products with WS fluxes. We are currently leaning toward Alpha WS609 flux, however the customer's interpretation of J-Std-001C feels that type 'H' fluxes (WS) are not allowed. Any

Conformal Coat Masking

Electronics Forum | Thu Jul 25 10:52:26 EDT 2002 | waynesmith

I've been tasked with increasing the CCA throughput in our Conformal Coating workcenter. My first approach will be to look into a more *automated* approach for the masking process. We currently use a manual method of using masking tape prior to con


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