Electronics Forum | Fri Oct 01 09:03:25 EDT 1999 | Dave F
| | | We are all faced with increasing interconnect density in all we do. This means smaller everything, especially components and that which they are mounted upon but, hopefully, without smaller minds and thoughts. It all demands more process contro
Electronics Forum | Thu Aug 05 06:29:18 EDT 1999 | Graham Naisbitt
| | | We're getting field failures in a high impedance portion of the circuit. Think the unpopulated pc card has contaminates because we were able to grow dendrites by applying a 9 volt battery across the suspected pad, placed a drop of de-ionized w
Electronics Forum | Thu Jul 15 08:03:36 EDT 1999 | Mark Quealy
| | I am trying to solder a 388 ball BGA to an Andon Electronics Corp. BGA socket adapter and I am having problems in the reflow of this part. I put no clean paste flux in the solder cups of the adapter then put the BGA part onto the adapter and run
Electronics Forum | Mon May 31 21:50:59 EDT 1999 | Dave F
| | I have always thought it to be a good practice to wash SMA's with water soluble paste (WS609) soon after reflow. Is there a time limit as to how long a board should sit after reflow before washing said board? For instance; processing a double-
Electronics Forum | Tue Apr 13 23:08:56 EDT 1999 | Jeff Sanchez
| | | Netters, | | | | | | When I reflow a PCB there is a discoloration of silkscreen and mask. It appears if Profile is too hot! But I dont think so, maybe I'm wrong? | | | | | | 1. Kester 293 no clean | | | 2. 2.1 C/s for 30s to 150 C | | | 3.
Electronics Forum | Mon Apr 05 08:25:31 EDT 1999 | ADRIANO FERNANDES
| | | I require some feed back from any one who knows about using a voc free flux in a nitrogen wave solder machine soldering both through hle and smt componants. | | | What disadvantages are there when using this flux? | | | Do you have any contact
Electronics Forum | Wed Mar 24 12:34:33 EST 1999 | Scott McKee
| Hi, | I have a customer who's electronic assemblies produce RF. He is insisting upon aqueuos cleaning. We switched to a no clean solder years ago and no longer have an aqueous system. | Is aqueous cleaning necessary to eliminate 'cross talk' of
Electronics Forum | Sat Mar 27 12:36:34 EST 1999 | Scott Cook
| Hi, | I have a customer who's electronic assemblies produce RF. He is insisting upon aqueuos cleaning. We switched to a no clean solder years ago and no longer have an aqueous system. | Is aqueous cleaning necessary to eliminate 'cross talk' of
Electronics Forum | Wed Mar 24 23:04:00 EST 1999 | Al O Owzitgon
| We are dealing with down time accredited to the Pumps getting clogged with dried glue. We have decided to purge all spindles at 6 hour intervals. We are looking at making this process automated. Has anybody tried this and if so, is there a way to s
Electronics Forum | Fri Aug 06 10:27:05 EDT 1999 | Kenneth Hedman
| | I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? | | | | Thank you, |
