Electronics Forum | Thu May 29 12:13:53 EDT 2008 | mikesewell
Profiling is covered in "IPC 7530 Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes".
Electronics Forum | Wed Jun 26 14:31:28 EDT 2019 | slthomas
I meant to ask before, what are you using to record the profile?
Electronics Forum | Thu Nov 30 16:30:46 EST 2023 | kojotssss
Which profile type is used, RTS or RSS?
Electronics Forum | Wed May 19 10:48:40 EDT 1999 | Glenn Robertson
| | | We are currently looking at purchasing some BGA rework equipment. Could someone give us the pro's and cons of IR heating (top/bottom)vs. hot air convection ? | | | All other tips are also welcome. | | | | | | Thanks | | | | | Philip, | | I ha
Electronics Forum | Wed Jul 03 10:37:41 EDT 2013 | sara_pcb
My circuit board contains 11 x 11 matrix 1mm pitch BGA, The device was tested in socket on evaluation Board. We handed over the actual PCB & devices for re-flow. The assembly house first re-flowed all the SMT components other than BGA. BGA was placed
Electronics Forum | Tue Aug 09 12:09:26 EDT 2005 | mtd
I am having reflow issues with small 6 pin SOT's. The joints on these components still look like solder paste after the reflow oven. I have tried adjusting the profile on forced air oven. Any recommendations as what to change in the profile or proces
Electronics Forum | Tue Feb 24 16:40:54 EST 2015 | duchoang
Could you show us the reflow profile and 0402/0201 pictures? I have had the same situation before just because insufficient solder paste ( Specially on 0201) and maybe not enough heat reflow profile.
Electronics Forum | Thu Sep 02 12:08:22 EDT 1999 | Doug Philbrick
| Could someone shares their experience on the causes of 'Open' in the BGA after reflow. | | Reflow prifle is also critical, as usual. On large boards board support is also a factor. If the board warps at the BGA you can experience opens. Good Luck
Electronics Forum | Thu Feb 14 08:14:12 EST 2008 | davef
Questions are: * Do the BGA pads on the board take solder when you solder them by hand? * What is the temperature on the BGA pads during reflow? * What is the temperature on the other component pads during reflow?
Electronics Forum | Thu Oct 13 16:08:11 EDT 2011 | davef
BGA solder joint reliability is actually improved slightly from a double-sided reflow. [Jean-Paul Clech APEX 2003 Solder Joint Reliability of BGA Assemblies]
