Electronics Forum | Thu Dec 30 23:25:49 EST 1999 | Henry C. Yao
We're using 96.5/3.5 high temp solder paste for our production and we're encountering soldering defects particularly non wetting (tombstoning). A technical document I read mentioned that there is a sort of a problem with the wettability of this paste
Electronics Forum | Tue Dec 28 09:36:34 EST 1999 | Dan Woodward
Certainly automatic placement, preferably with vision system assistance will yield a more repeatable process. Process repeatability (paste deposition, connector placement, reflow cycle, etc.) will be your key to success here. Another possibility yo
Electronics Forum | Thu Dec 19 13:55:35 EST 2002 | John
I don't know what type of boards you are doing but if they are through hole or surface mount. You can get a whole line of used equiptment for pennys these days. I am sure that I could send you a quote for a complete line. The price of used equiptment
Electronics Forum | Wed Nov 17 09:02:57 EST 1999 | Dave F
John: The 180 Tg point is a sweet spot for obtaining heat resistance, cost effectivly. These high technology boards provide good thermal resistance for wire bonding, direct chip attach, and BGA mounting and rework. Since these boards are harder th
Electronics Forum | Wed Oct 20 19:36:45 EDT 1999 | Dennis O'Donnell
Hi Mark: Running a wire under a BGA is possible, however if you plan to mount the BGA over the wire you would want to make sure that the wire insulation will withstand the heat of the reflow temperature. A more reliable way would be to lay a trace
Electronics Forum | Fri Oct 15 11:05:50 EDT 1999 | Mark Phinney
Earliar we had problems with board warpage, Much of our problem was due to imbalances in the copper on oppisite layers in brief on a 8 layer board the copper on layer 1 should = the copper on layer 8, 2=7, 3=6, 4 = 5. We added copper to some layers t
Electronics Forum | Wed Oct 06 09:40:49 EDT 1999 | Mark Quealy
I have an adhesive dispenser in my workcenter but I rarely use it. I've replaced this process with wavesolder pallets for bottom side PTH soldering, ocassionally gluing parts left exposed by the pallet. So I was thinking of selling the dispensing equ
Electronics Forum | Wed Oct 06 20:42:50 EDT 1999 | Mike Cooper
Yes. We use high speed dispensing (PanasonicFA)as an integral part of our PCB assembly. Our business is automotive electronics and our typical product is 2-sided smd with some through hole. We assemble topside first, through hole, then bottomside. Th
Electronics Forum | Wed Sep 29 17:36:02 EDT 1999 | Earl Moon
We are all faced with increasing interconnect density in all we do. This means smaller everything, especially components and that which they are mounted upon but, hopefully, without smaller minds and thoughts. It all demands more process control and
Electronics Forum | Mon Sep 20 10:17:19 EDT 1999 | Jeanjean
Hi all, As a student in elctronic sciences, I'd like to know why there is a difference in the voltage required for PC boards with surface mounted devices and the voltage needed by traditionnal components like leaded film capacitors? I wonder if it
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