Electronics Forum: part (Page 1015 of 1117)

Re: SMT process benchmarks??

Electronics Forum | Wed Jun 10 18:50:36 EDT 1998 | Earl Moon

| | | Does anyone have any info./studies on what the percentage or PPM defect rates are for each part of the typical SMT process. | | | Example: | | | Screen Print = 45% of total defects | | | Component Placement = 25% of total de

Re: BGA In-circuit Failure Analysis

Electronics Forum | Mon Jun 08 11:39:28 EDT 1998 | Earl Moon

| How do I mechanically/visually inspect BGA devices when they are soldered to a PCB for possible solder, or other, defects as a first step before part removal and further analysis? I have had board failures due to poor soldering--I think? I can pr

Re: TCP solder / desolder / rework

Electronics Forum | Thu Jun 18 10:57:28 EDT 1998 | Mike Moninger

| We offer an upgrade service for notebooks with 486 SX/DX CPUs up to 586-133 MHz using the AMD 5x86-133 MHz CPU in the PQFP package. We are pretty succesful with this service and until today we did more than 1000 notebook upgrades this way. | Now,

Re: Solder masks for gold fingers/Try Rubber Shunts

Electronics Forum | Thu Jun 04 20:52:57 EDT 1998 | D.Lange

| | I have gold fingers that I want to mask when running over the wave without pallets. They're on the leading edge of the board. I recall seeing rubber boots that slid onto the fingers to mask them. Pop 'em on before the wave; pop' em off after a

Re: BGA Pad Dressing After Removal Method

Electronics Forum | Thu Jun 04 11:23:25 EDT 1998 | Justin Medernach

| What methods do people use to dress pads after removing and before replacing the BGA? | We use solder wick and a soldering iron, focusing on not "dragging" the wick across vias. This is laborous and booring. Who has a better way? | Dave F Dave, Her

Re: BGA Pad Dressing After Removal Method/Paste Flux?

Electronics Forum | Sat Jun 06 07:04:27 EDT 1998 | Dave F

| | What methods do people use to dress pads after removing and before replacing the BGA? | | We use solder wick and a soldering iron, focusing on not "dragging" the wick across vias. This is laborous and booring. Who has a better way? | | Dave F | D

Re: BGA Pad Dressing After Removal Method

Electronics Forum | Thu Jun 04 22:36:23 EDT 1998 | Dave F

| | What methods do people use to dress pads after removing and before replacing the BGA? | | We use solder wick and a soldering iron, focusing on not "dragging" the wick across vias. This is laborous and booring. Who has a better way? | | Dave F | D

Re: Providing Thermal Relief On Vias

Electronics Forum | Wed Jun 03 14:17:12 EDT 1998 | Earl Moon

| Hello: | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints, op

technical stuff review

Electronics Forum | Sat May 30 18:33:02 EDT 1998 | Earl Moon

This message is to Cunli and his great staff who keep us flying straight and level while reminding us always to keep our nose down in the turns. (can't keep from doing some of that pilot "s__t" Mav. I, I mean we, would like to post some tempters as a

Re: technical stuff review

Electronics Forum | Mon Jun 01 09:32:29 EDT 1998 | Dave F

| This message is to Cunli and his great staff who keep us flying straight and level while reminding us always to keep our nose down in the turns. (can't keep from doing some of that pilot "s__t" Mav. | I, I mean we, would like to post some tempters


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