Electronics Forum | Sat Jun 09 00:53:34 EDT 2001 | ianchan
Hi Folks, My Production runs a uBGA-liken product, and uses Pallets to support the 0.8mm thick pcb, during the SMT + reflow oven process. Process/QA see occurs: 1) 0402 unsolder? 2) 0402 tombstone? 3) "uBGA" poor-visual joints (dry joints)? Took
Electronics Forum | Fri Jul 23 09:01:36 EDT 1999 | Earl Moon
| HI Earl | Thank you for your answer. | Let me know you about the hot you mentioned | First of all, The rework machine is the BGA3500 (manufactured by 0.k international:U.S.A) | ��DESOLDERING HEAT :OVER 200��(CENTIGRADE),30SEC(CHECKED
Electronics Forum | Sat Mar 29 08:38:28 EST 2003 | davef
Iman When you talk about your profile, can we assume you're measuring it on the pads of LGA? Profile the solder paste reflow by placing a thermal couple under the component pad, similar to a BGA. On a slight tangent, as with soldering BGA, paste
Electronics Forum | Tue Feb 20 16:51:22 EST 2001 | davef
You should evaluate products from Datapaq, Electronic Controls Design, and Kic Thermal Profiling. Each sells very good reflow profiling equipment. Beyond the straight forward issues surrounding the question of "Does this thing produce a good profi
Electronics Forum | Thu Oct 22 11:11:58 EDT 1998 | Hon
Dear all, What are your views on reworking BGA's? I mean, with the BGA going through reflow temperatures four times or more, and with a manual reballing process, wouldn't it raise up a few reliability issues? Would you consider not doing rework on
Electronics Forum | Mon Sep 24 20:38:27 EDT 2001 | davef
Mike's comments are well taken. Your technique works fine with BGA, but uBGA are less forgiving. Again, let's take about: * Specifics of the problem. * Amount and method of applying flux. * What's holding the uBGA in-place before the solder ball an
Electronics Forum | Fri Sep 07 16:37:47 EDT 2012 | burb1999
Ive used the Camalot long time ago to dispense paste on BGA pads after removal then reflow with a machine such as the AirVac. What is the best way to do BGA repair on pads? Ive read alot just reball the bga then put it back on? Todd
Electronics Forum | Wed Apr 03 14:16:16 EDT 2019 | davef
My take ... * Just about every BGA in the world is soldered in a reflow oven * A small portion of the BGA are soldered with rework / repair stations * A very small number of BGA are soldered with hot plates, toaster ovens, selective soldering mach
Electronics Forum | Fri Jun 29 09:51:27 EDT 2007 | bjrap3
I have never had a problem with any other BGA's that I reworked. I recently found out that the BGA that we are trying to rework is made poorly and warps automatically from the heat. There is nothing that we could do to prevent this. Also the board
Electronics Forum | Mon Aug 25 18:27:58 EDT 2008 | dyoungquist
Here is a post of the current profile. I have contacted our solder paste provider. They give a general lead free reflow profile guide. All that shows is genreral recomendations for temperature ranges and time ranges in each section of a typical
