Electronics Forum | Thu Jul 13 10:10:48 EDT 2000 | Todd
Donnie In response to your questions; 1. Flux is Multi-core X32-10M 2. Preheaters temperatures can range based on board density. the goal is to get the top side to 100C before wave. 3. Components can't be placed after wave solder, they are surface m
Electronics Forum | Fri Jul 07 09:15:23 EDT 2000 | K. Chak
Hi Dave, This particular p/n calls for print&etch for wet process..and the problem occured due to surface contamin. with resist residue resisting copper from etching off. The high pressure nozzle was a problem at developing oper. and it is fixed now
Electronics Forum | Fri Apr 28 13:23:22 EDT 2000 | Chris McDonald
We have had nsome new products come in that require Bottom side wave soldering (SMT). I have SOIC's 1206, 0805 that are Glued then Wave soldered. I have had trouble with bridging and no-clean residue with these pcbs. I have a Econopak 2 SMT two zone
Electronics Forum | Fri Jan 19 06:49:34 EST 2001 | Adam
To you wavesoldering guru's. When wavesoldering with a selective wavesoldering carrier What causes the white vapor type residues around the areas of the carrier which are exposed to the wave ? My Initial reaction was to high of A Pressure for the spr
Electronics Forum | Mon Jan 29 20:25:54 EST 2001 | davef
I know you're talking Humiseal, but this may help http://www.loctite.com/electronics/elec_tech_index.html Conformal Coatings (PDF Documents) "Conformal Coating Overview" (Lester D. Bennington, Senior Development Chemist and David Crossan, Manager
Electronics Forum | Wed Apr 04 08:57:13 EDT 2001 | Cal
IPC-TM-650 is a works well. Ionic conductivity is a good rule of thumb but I prefer ION Chromatography this will help determine the residues left behind from the fab process. There are a bunch of ways to determine solderabiltiy- Wet Balance and SERA
Electronics Forum | Wed Apr 11 17:03:28 EDT 2001 | mparker
I've used Super Glue, with Kapton tape. The glue leaves a small residue and the tape acts as a strain relief. If you can sacrifice the board, drill a small hole through the board, push the exposed ends of the thermocouple up from the back side, lay
Electronics Forum | Thu Jul 20 13:08:35 EDT 2000 | Bob Willis
The solder paste formulation is different 63/37 is a tin lead alloy so t here is one difference from a lead free. Yes you can get no clean lead free products but if you compare the amount of visible residues they will be normally higher. So far most
Electronics Forum | Wed Jun 13 21:33:34 EDT 2001 | davef
Todays crazy idea?! (environmental safe) February 22, 2001 05:33 AM Mattias Andersson [http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&&Message_ID=5343&_#Message5343] Turning things just a bit, our working theory is: burnt flux
Electronics Forum | Mon Jun 25 20:35:44 EDT 2001 | davef
According to J-STD-004 "Requirements for Soldering Fluxes", fluxes are classified by their chemical composition, activity level and halide content. In this scheme, each flux type is identified by a 4-character designator, where: * First two character
