Industry News | 2021-10-07 15:29:25.0
Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its TempSave series in Booth #3301 at the SMTA International Exposition, scheduled to take place Nov. 3-4, 2021 at the Minneapolis Convention Center in Minneapolis, MN. The company also will showcase SN100CV P608 solder paste.
Industry News | 2022-10-06 18:19:54.0
Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its TempSave series in Booth #1230 at the SMTA International Exposition, scheduled to take place Nov. 2-3, 2022 at the Minneapolis Convention Center in Minneapolis, MN. The company also will showcase SN100CV P608 solder paste.
Industry News | 2023-09-11 17:19:08.0
Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its SN100CV P608 solder paste in Booth #1415 at the SMTA International Exposition, scheduled to take place Oct. 10-11, 2023 at the Minneapolis Convention Center in Minneapolis, MN.
PCB rejection is used for store the NG PCB, pass the OK PCB. NG board capacity: 5pcs. Panasonic PLC controller. More conveyor system machines, welcome to contact : E? sales@obsmt.com T:86-13926596436 (wechat/whatsapp)
Oriental Motor USA Corp.
Industry News | 2001-11-20 17:20:21.0
From Oriental Motor USA Corp
Industry News | 2015-10-13 19:27:42.0
SHENMAO Bumping Solder Paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) aim to decrease voids in wafer bumping process. SHENMAO MICRO MATERIAL INSTITUTE applications engineers focused on developing the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void (
Industry News | 2016-05-21 07:36:35.0
SHENMAO Bumping Solder Paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) aim to decrease voids in wafer bumping process. SHENMAO MICRO MATERIAL INSTITUTE applications engineers focused on developing the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void to optimize manufacturing process performance. The world’s largest IC Packaging and Test Service OSAT utilize SHENMAO Bumping Solder Paste in production.
Industry News | 2016-07-07 14:47:47.0
SHENMAO Bumping Solder Paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) aim to decrease voids in wafer bumping process. SHENMAO MICRO MATERIAL INSTITUTE applications engineers focused on developing the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void to optimize manufacturing process performance. The world’s largest IC Packaging and Test Service OSAT utilize SHENMAO Bumping Solder Paste in production.
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