Electronics Forum | Fri Aug 07 07:55:30 EDT 2009 | robhs
Hi. We are planning a production run of a board that utilises the SEMTECH SLP2710P8 8-pin device (2.7 x 1.0 x 0.58mm). The part orientation on the board necessitates that the squeegee print direction approaches the stencil apertures on the long side
Electronics Forum | Tue Aug 24 23:04:14 EDT 2004 | pdeuel
If this code is on a ceramic cap then it is a 0.1uf cap. We have a conversion charts that list most all codes. Useing the last 2 digets only determine the value. The capatol letters A thru Z are given specfic numerical value. Example A0 is 1.0pf, A1
Electronics Forum | Sat Dec 14 02:29:52 EST 2013 | padawanlinuxero
Hello I hope this helps For a component with axial leaded - vertical The clearance of the component body or weld bead above the land is 1.00mm (0.039in) Component body must be perpendicular to the board The overall height does not exceed maxim
Electronics Forum | Mon Dec 23 17:24:59 EST 2002 | davef
Guessing at the meaning of your description of �res., fmf, .100, 3010, 1, S�: * res - Resistor * fmf � �mf� tells you �metal film� �fmf� tells you �flame metal film� type * .100 - Precision tolerance 0.1%, although it could be power rating. * 3010 �
Electronics Forum | Thu Aug 26 11:01:47 EDT 1999 | Wolfgang Busko
| For space contracts we have to mount chip capacitors/ resistors etc 0.1 to 0.4 mm from the pad height. | | This is to compenstae for the CTE differential in the substrate/component and also to ensure cleanliness. | | Does anyone have any new idea
Electronics Forum | Wed Sep 01 14:07:41 EDT 1999 | Dave F
| For space contracts we have to mount chip capacitors/ resistors etc 0.1 to 0.4 mm from the pad height. | | This is to compenstae for the CTE differential in the substrate/component and also to ensure cleanliness. | | Does anyone have any new idea
Electronics Forum | Sun Apr 19 13:52:45 EDT 1998 | D.Lange
| We have to mount our SMD devices 0.1 to 0.4 mm off the pcb | PCb substrate to compensate for thermal stressing in a | Space enviroment. Has any one any ideas or contacts for | dissolvable pads. this only applies to leadless components Robert, PPI
Electronics Forum | Sun Apr 19 13:50:41 EDT 1998 | D.Lange
| We have to mount our SMD devices 0.1 to 0.4 mm off the pcb | PCb substrate to compensate for thermal stressing in a | Space enviroment. Has any one any ideas or contacts for | dissolvable pads. this only applies to leadless components Robert, PPI
Electronics Forum | Fri Apr 02 16:45:29 EST 2004 | cedams
Ken, You'd think so but the tooling pins only register to the drilling process for the PCB. The fiducial registers to the copper pattern and for both glueing and placing SMT components the pads are more important than the holes. That's why the machi
Electronics Forum | Mon Aug 08 16:14:36 EDT 2011 | wmburke
We are building a plasma diagnostic to monitor MHD phenomena in tokamak. As part of the development, we need high-voltage, high-power RF capacitors to tune and match an inductive load. This application is similar to a small induction heater, with t
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