Electronics Forum: 003 (Page 11 of 13)

BGA Straight crack

Electronics Forum | Tue Feb 26 10:55:58 EST 2002 | davef

This could be an electroless nickel / immersion gold specification. While the symmetry of the numbers is pleasing to the eye, but as Joyce Marchand says, "It doesn't blow-up my skirts." Problems with your specification are: * Lower end of the gold

Systems for Solderability-tests

Electronics Forum | Wed Jun 26 08:54:53 EDT 2002 | davef

it has a lousy gage. * Solderability testing machines from different suppliers produce dissimilar results. * Tests don�t well represent in-use. For instance, how does one test the solderability of a BGA? [Ooo, ooo. I know the answer. => For BGA and

SMT

Electronics Forum | Tue Aug 27 22:07:45 EDT 2002 | davef

Pad. Land. A portion of a conductive pattern used as a termination area. Metal surrounding a hole on a printed circuit board. Mask. A material applied to allow selective etching, plating, or protection of the surface of a printed circuit board.

About the PCB gold finger contamination.

Electronics Forum | Thu Sep 19 21:23:42 EDT 2002 | davef

I'm not saying that an eraser will necessarily work. What I'm saying is that some erasers may cause more trouble than the eliminate. Look here http://aic.stanford.edu/jaic/articles/jaic28-02-003_2.html We prefer a brand called Ruby Red. The "ole

Double-sided reflow with a Altera 240-pin RQFP

Electronics Forum | Mon Jun 30 16:35:13 EDT 2003 | davef

Hi Steve We don�t double reflow this part. We wouldn�t consider it without a fixture or some other support. You know that sound, the almost involuntary sound that patrons in a restaurant make when a waiter drops a glass or a tray? It�s kind of an

Wave Solder Non wetting holes

Electronics Forum | Wed May 18 14:58:05 EDT 2005 | splice

Hi, I am having some PTH non wetting issues. Setup and chronology of events is explained: Set Up; Part: 1 MM pitch connector 378 pins Solder: Kester Ultra Pure 63/37 solder Pot; 250 C pre heat; Peak 94C top side Flux: Qualitek 775, Fluxer: foam T

Flux not foaming

Electronics Forum | Tue Sep 20 11:59:06 EDT 2011 | SheanDalton

Check specific gravity: According to a quick web search, the specific gravity should be 0.813 ± 0.003. If you have records of the specific gravity, compare current reading to past readings. Check pressure near stone: if you have records, compare

Re: Micro-BGA soldering

Electronics Forum | Tue Jul 27 11:32:01 EDT 1999 | M.L.

| | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | 12BGA per assembly | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | Pads .014inch | | Vias within footprint .020inch | | Vias to be filled by bottom side(solder side) only

*****Update: Depanelization Troubles; Please Read*********

Electronics Forum | Thu Jun 18 15:04:48 EDT 1998 | smd

| | | We're running into problems with board damage (broken traces, solder shorts) due to pliers and other bizarre tools being used for depanelization. I need some sort of fixture for this. A delrin plate with a slot cut to the correct depth and wid

Re: Ok Earl I give already!

Electronics Forum | Tue May 19 05:42:36 EDT 1998 | Earl Moon

| Earl, | I admit that I missed your article since I seemed to have let my subscription to Circuit Fabrication Magazine expire. I am interested in your experience in this area. Is there a way to get a copy of your paper? Could you maybe post it to


003 searches for Companies, Equipment, Machines, Suppliers & Information

2024 Eptac IPC Certification Training Schedule

Training online, at your facility, or at one of our worldwide training centers"
SMT feeders

High Resolution Fast Speed Industrial Cameras.
thru hole soldering and selective soldering needs

High Precision Fluid Dispensers


"回流焊炉"