Full Site - : 0805 on 0603 pads (Page 11 of 16)

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Fri Jul 16 03:11:23 EDT 1999 | SPEZZAFERRI Luca

| | | Hi, | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | | | Sec

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Tue Jul 13 10:26:38 EDT 1999 | HST-SE

| | Hi, | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | Secondly, I n

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Thu Jul 15 14:38:38 EDT 1999 | JohnW

| | | | | | Hi, | | | | | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants)

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Tue Jul 13 14:19:00 EDT 1999 | JohnW

| | | Hi, | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | | | Sec

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Tue Jul 13 14:25:57 EDT 1999 | Earl Moon

| | | | Hi, | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | |

ECOs on OSP finish

Electronics Forum | Sat Jun 30 04:43:09 EDT 2001 | brendan

Hello We introduced OSP finish on some of our products but now need to add some discretes at the end of the process. From my little knowledge of OSP, this is difficult. We'll SMT the boards and transfer them to another site for further processing.

Re: need info on non contact adhesive dispensing

Electronics Forum | Sat Apr 18 10:29:47 EDT 1998 | Steve Gregory

| Have mixed technology board and am interested to hear any info on the Nordson non-contact adhesive dispenser. | I woud appriciate any feedback I could get. I am currently using a contact system and am tired of breaking needles and need a way to spe

Re: need info on non contact adhesive dispensing

Electronics Forum | Tue Sep 22 20:08:58 EDT 1998 | Dave Brand

Rick: I'd be happy to give you information on the system benefits and limitations. I work for Asymtek so please email me back so we can talk off-line. Thanks. -Dave Brand | | | Have mixed technology board and am interested to hear any info on the No

Non-wettig on chip cap.

Electronics Forum | Mon Dec 10 04:15:01 EST 2001 | Beny

Thanks for your advise Now I don't found Non-wetting defect at TIN COATED 0603 after I had increased peak temp and Time above 183 C. At film caps, I still found Non-wetting in high rate at film chip size 2416. I using PANASONIC's part with identif

Inconsistent mounting on TOPAZ-X

Electronics Forum | Wed Nov 12 06:23:09 EST 2008 | griffin

One thing to consider regarding the capacitor, The leads are not 100% straight beneath the plastic bottom part. And if you align with regards to the two leads, the leads will be aligned to the pads of your board, but the body of the capacitor is look


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