Electronics Forum | Wed Aug 21 17:50:05 EDT 2002 | davef
First, it�s GREAT that your defect rate of 282 is very close to your Boss� goal of 50 ppm. Second, your Cpk and your ppm numbers don�t tie out with our expectations. You say Cpk for: * mounter is 1.0 and �your mounting is 83ppm�. * printing is 1.33
Electronics Forum | Fri Dec 01 00:37:20 EST 2000 | arminski...aka..Dreamsniper
I have a proto-type PCB with a 48-Pin Fine Pitch TSOP (0.5mm pitch) with a dimension of 19mm L x 11.50mm W x 1.10 Thickness. They are at the bottomside of the PCB and I need to wave solder the board. There are 8 of them at the bottom side. Are they o
Electronics Forum | Fri Oct 01 06:02:43 EDT 1999 | Bach Huss
Hi, We are running 0402 component on the TCM1000 and we find that teher will be missalignment on 0402 Capositor. We have identified that the missalignment is caused by the wrong information from the vision system while doing vision centering. The sy
Electronics Forum | Thu Sep 23 10:11:15 EDT 1999 | Earl Moon
| Hi All, | | I'm recently receiving an IC in package for Ic's sensitive to moisture and not in another times, Somebody know how can I know if this Is moisture sensitive or not(which is the rule ?)?. the Ic is a soic14. | | | thanks | | I appreci
Electronics Forum | Tue Apr 27 12:14:08 EDT 1999 | M Cox
Board Experts I am fighting with a board house about a delamination problem.. First the facts 1) 10 layer board .063 thick HASL Finish Aprox 16 in x 17 in. 2) 150 Boards with this part number built with the same reflow oven settings (212 c max t
Electronics Forum | Mon Oct 19 15:37:12 EDT 1998 | Manish
Hello everybody This is kind of urgent for me. I would appreciate if anyone of you could tell me where could i find information about the different dicing techniques and operations used in the industry. I need information about the following: 1
Electronics Forum | Wed Oct 21 08:16:40 EDT 1998 | Andy
| Hello everybody | | This is kind of urgent for me. I would appreciate if anyone of you could tell me where could i find information about the different dicing techniques and operations used in the industry. | | I need information about the fol
Electronics Forum | Thu Jun 25 21:13:11 EDT 1998 | Phillip Hunter
| looking for help with fine-pitch printing for what would be the best settings for printing speed, squeegee pressure, seperation speed. | thanks for you time Print speed is determined by your aperture dimensions, paste viscosity type of blade (metal
Electronics Forum | Mon Nov 25 09:06:15 EST 2002 | jax
You might want to check the tin thickness. I believe you have a minimum of .65 microns in order to achieve a good solder joint through 3 thermal passes. In an immersion tin process, the ability to solder is time and temperature dependant. As the int
Electronics Forum | Mon Jan 20 17:42:45 EST 2003 | jonfox
Double check the data sheets for your paste. Just as an example, ou Indium paste has a recommendation for the Heating, Liquidus, and Cooling stagees of reflow. They recommend a linear ramp up of 0.5 to 1.0 degree C. In the Liquidus stage, a peak t
