Electronics Forum: 127 (Page 11 of 11)

SiPlace S25 Machine Controller HDD rebuild - error Software booting

Electronics Forum | Tue Feb 22 22:39:22 EST 2022 | cirsol

Hi, Sorry I didn't see your previous post. I do have an update but will answer your questions first. {So you only rebuilt the MC HDD and didn't rebuild the Station PC? Am I right ?} Yes that's correct, we only rebuilt the MC HDD but were not able t

Quad 4C part placement rejection

Electronics Forum | Wed Nov 16 14:44:31 EST 2011 | olddog

Bobpan, thank you for your speedy response. As to the items you noted: 1. I did a test of Funct 30 for the first 5 nozzles, 2 times each as follows: noz1 Ht=215 & 219, center=1005 (all nozzles all tests), run out 2.2 & 2.7. Noz2 Ht=228 &228, runout=

Quad 4c not placing components

Electronics Forum | Wed Sep 04 09:47:41 EDT 2019 | smrsteve

Hello All, I've just bought a Quad 4c pick & place machine. It's so close to actually building boards, but just doesn't quite get there. I was wondering if there's somebody out there with experience of these machines that might be able to help...?

Need Help for CCGA Rework

Electronics Forum | Tue Nov 01 15:26:43 EST 2005 | GS

Is it this your first experience of C-CGA RWK ? In order to approach a RWK of this kind of pakage it requires a capable process and clear operating procedure. In the past, the company who I use to work for, we rwkd plenty of this kind of CCGA. Earl

Damaged PCB.. what do you think?

Electronics Forum | Fri Mar 16 10:04:41 EDT 2012 | davef

We'd repair a drop board like this. Here's what our old friend Jeff Ferry said is a published article ... When boards lose their edge: when the corner of a circuit board breaks or is damaged, the problem cannot be ignored by Jeff Ferry One of the m

aluminium wire bonding on Electroless Nickel + Immersion gold

Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef

This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R

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