Electronics Forum | Mon Oct 12 15:51:47 EDT 2015 | davef
IPC-A-610E-2010, Acceptability of Electronic Assemblies, 8.3.4 Castellated Terminations talks to the acceptability of solder connections on components like yours. It’s tough to say from the pictures, but I’d say your issues are: Missing solder: Plat
Electronics Forum | Mon May 09 13:55:33 EDT 2016 | dyoungquist
Omega Aqua Clean LPH. The flux we use in our selective solder process is Kester 2235. Our process cleans water soluble flux very well if cleaned within 24 hours of the boards being processed. We have sent boards off for cleanliness testing per sta
Electronics Forum | Thu Jan 19 12:33:23 EST 2017 | vercek
Hello Jorge, Have you been able to complete your C# app? I manage to do so for TPSYS 3.2 which uses PostgreSQL database. I'm looking to do the same with TPSYS 2.4. I understand it doesn't use SQL database. I'm looking for the type of database it a
Electronics Forum | Mon Jun 03 13:26:32 EDT 2019 | az2019
Hi, I have a general question about the relationship of PCB thickness and BLR testing result. For example, I have QFN6x6 parts mounted on board in 1.2mm, 1.6mm, and 2.4mm thickness. All boards have 6 layers of Cu. Studies show thicker board gives les
Electronics Forum | Thu Jun 24 07:50:36 EDT 2021 | ouaret
we have a Cyberoptics Flex ultra HR machine (model N 8010949). the alignment of camera 1,3,5 and 2,4 is impossible because the images from each Fire wire adapter don't have the same size. we tried to calibrate with the target board, but also unsucce
Electronics Forum | Mon Oct 25 13:06:54 EDT 2021 | richardcargill
Can anyone shed any light on the Speed configuration setting on a BTU VIP70? We're using Winconv2.4a if that matters. There are only 3 editable fields in the configurator, Pulses per unit - Power - Distance. I'm struggling to find out what constitu
Electronics Forum | Wed Apr 26 14:06:46 EDT 2006 | mdm4ua
Hi JEM, We just made the very same upgrade you are looking to make on three machines. We purchased a new MY12 and upgraded our other three (My9 W/hydra, My9 No Hydra, and TP9-2U) from 2.2.4C to 2.4.4c. There are several changes and most of the
Electronics Forum | Sat Aug 03 07:29:20 EDT 2002 | davef
IPC-PE-740 "Troubleshooting for Printed Board Manufacture and Assembly" has words to the effect of � 1.5---BAKING Laminate materials are baked several times during the manufacture of a printed wiring board. There are four major reasons for
Electronics Forum | Mon Jun 21 09:32:28 EDT 1999 | Glenn Robertson
| Do anyone have any experience on assembling high frequency product, 1.8GHz or 2.4GHz. | | In our production line, we manufacture 1.8GHz product with using no clean paste (RMA type) for reflow and no clean wire for rework. In our functinal test,eit
Electronics Forum | Tue Jun 22 09:59:38 EDT 1999 | Vic Lau
| | Do anyone have any experience on assembling high frequency product, 1.8GHz or 2.4GHz. | | | | In our production line, we manufacture 1.8GHz product with using no clean paste (RMA type) for reflow and no clean wire for rework. In our functinal te
