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| https://www.eptac.com/ask/solder-touching-glass-body-components-like-diodes/
: IPC-610 has many areas that are left to ones interpretation. The area for solder touching glass body components is one of them. The IPC mentions this along with the subject of maximum fillet height and the image that sets in some peoples minds is that
1st Place Machinery Inc. | http://www.firstplacemachinery.com/first_place_smt_pcb_aoi_mvp.html
. System can inspect SMT components pre-or post solder for presence / absence and placement verification (x,y,and theta ) polarity, solder fillet, bridging, solder opens, insufficient fillets, excess solder, and lifted leads
| https://www.eptac.com/wp-content/uploads/2013/06/eptac_07_17_13.pdf
| https://www.eptac.com/wp-content/uploads/2021/11/eptac_07_17_13.pdf
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_jedec-standard-footprints_topic2063.xml
:46pmYou need separate Chip land patterns for Capacitors and Resistors. Capacitors should have a side fillet and Resistors do not. However, IPC says that the same pattern can be used for both because the Side Fillet is not required per IPC-J-STD-001
