Industry News: 2mm (Page 11 of 13)

Sono-Tek to Debut SonoDry 1000 Spray Drying System at INTERPHEX 2008

Industry News | 2008-01-31 16:45:57.0

Milton, NY � January 31, 2008 � Sono-Tek Corporation, the world leader in the development and application of ultrasonic atomization technology and spraying and coating application systems, announces that it will introduce the SonoDry 1000 spray drying system in booth 1639 at the upcoming INTERPHEX 2008 exhibition and conference scheduled to take place February 14-15, 2008 at the Puerto Rico Convention Center in San Juan, Puerto Rico.

SONO-TEK CORPORATION

Digi-Key and Harwin Sign Global Distribution Agreement

Industry News | 2010-08-24 12:11:13.0

Electronic components distributor Digi-Key Corporation, recognized by design engineers as having the industry’s broadest selection of electronic components available for immediate shipment, and Harwin today announced the two companies have entered into an agreement in which Digi-Key will distribute Harwin’s products to customers worldwide.

Digi-Key Corporation

ECT’s CPG To Showcase the ZIP® Family at BiTS™ Burn-In & Test Socket Workshop

Industry News | 2011-02-26 16:22:43.0

Everett Charles Technologies' (ECT) Contact Products Group (CPG) will showcase the latest additions to its ZIP® family of flat technology Pogo® pins in Booth A04 at the upcoming BiTS™ Burn-In & Test Socket Workshop, scheduled to take place March 6-9, 2011 at the Hilton Phoenix East/Mesa Hotel in Mesa, AZ.

Everett Charles Technologies (acquired by LTX-Credence, which was acquired by Cohu)

ECT’s CPG to Highlight the ZIP® Family at Semicon China 2011

Industry News | 2011-03-07 14:43:24.0

Everett Charles Technologies' (ECT) Contact Products Group (CPG) will showcase the latest additions to its ZIP® family of flat technology Pogo® pins in its distributor, Tronic Electronics HK Ltd.'s, Booth 2452 Hall 2 at the upcoming Semicon China Exhibition. A new eight-page ZIP® Product Portfolio brochure will be available for the first time at the ECT CPG booth. ZIP® recently has been granted US Patent Number 7,862,391.

Everett Charles Technologies (acquired by LTX-Credence, which was acquired by Cohu)

Hesse & Knipps, Inc. Opens Second Demo and Applications Lab on West Coast

Industry News | 2012-02-15 20:06:32.0

Hesse & Knipps, Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH recently opened a West Coast Demo and Applications Laboratory to provide enhanced applications and field support to customers throughout the western region. The Hesse & Knipps Demo and Applications Lab is located at the company’s manufacturer rep - Chalman Technologies - in Anaheim, CA. Hesse & Knipps also maintains an East Coast Demo and Applications Lab in Sterling, MA.

Hesse Mechatronics

Hesse & Knipps To Discuss “Large Diameter Wedge Bonding of Round and Ribbon Wire for Automotive Applications” at IMAPS Advanced Technology Workshop

Industry News | 2012-05-11 20:19:04.0

Hesse & Knipps, Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, will discuss "Large Diameter Wedge Bonding of Round and Ribbon Wire for Automotive Applications" during IMAPS 3rd Advanced Technology Workshop and Tabletop Exhibition on Automotive Microelectronics and Packaging, taking place at the Dearborn Hotel in Dearborn, Michigan May 22-24, 2012.

Hesse Mechatronics

Hesse & Knipps Appoints CWI Technical Sales as Rep for East Coast United States and Eastern Canada

Industry News | 2012-08-14 10:24:59.0

Hesse & Knipps, Inc., (www.hesse-knipps.com) has appointed CWI Technical Sales as its representative along the United States East Coast (states of CT, MA, RI, VT, ME, NH, NY, NJ, DE, MD, PA, WV, VA, NC, SC, GA and FL) as well as the Canadian provinces of Quebec and Ontario

Hesse Mechatronics

esse & Knipps Introduces New Extreme Loop Former Bondhead for Heavy Wire Bonders to Support High Density Module Bonding

Industry News | 2012-09-04 08:51:32.0

Hesse & Knipps, Inc., (www.hesse-knipps.com) has added the HBK08 Loop Former Bondhead to its BONDJET BJ935 and BONDJET BJ939 fully automatic heavy wire bonders to support growing requirements for high density module bonding.

Hesse Mechatronics

Koh Young Inspection Technology "Hits the Road" With 2013 U.S. Truck Tour

Industry News | 2013-01-23 13:35:10.0

Koh Young's award-winning patented 3D inspection technology is 'hitting the road' with a whirlwind Truck Tour of the United States, beginning at the Koh Young exhibit booth (#143) at IPC/APEX 2013, February 19 - 21, at the San Diego Convention Center.

Koh Young America, Inc.

Koh Young Unveils Advanced 3D Measurement, Process Solutions at APEX 2014

Industry News | 2014-03-19 13:27:35.0

Koh Young America and Koh Young Technology (Seoul, Korea) will demonstrate exciting new breakthroughs in PCB inspection at IPC/APEX 2014 in Las Vegas, Nevada this coming week.

Koh Young America, Inc.


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